In October 2019 Cavendish Kinetics was acquired by Qorvo, Inc. As a key part of the Qorvo MEMS team, I am responsible for readying next-generation RF MEMS technology for production. This includes transfer to HVM Foundry, Quality and Yield improvement, and working with both vendors and cross-functional teams to enable success in a changing technology.

★ Engineering Manager | Manufacturing Operations - Wafer Fab & Assembly (2012 – Present) While reporting to the VP of OPS, I’m responsible for leading the Micro-Electro-Mechanical Systems (MEMS) manufacturing operations (through Wafer Foundry and Back End Assembly) across the RF semiconductor and MEMS ecosystem, serving companies like Texas Instruments, Motorola, Broadcom, Sirf, Inphi, and Skycross.• Improved MEMS yield from 40% to 90% by managing transition from development to prototype and production. • Efficiently managed process transfer, yield analysis and improvement, ramp of MEMs process; coordinated material purchasing and supply distribution, in order to sustain manufacturability with wafer foundries & back end factories. • Effectively managing internal teams and external relationships with Foundry personnel (up to 20) across multiple functional areas (sales integration, quality control, operations, production and HVM manufacturing partnerships).• Transferred multiple CMOS/IC etch technologies from development to volume Fab; and RF-MEMS tech to Foundry.• Used Six-Sigma and LEAN processes to set up excursion prevention systems and proactively identified vulnerabilities.★ Process Development Lead (2008 – 2012)I was responsible for managing a team of 5 process engineers and a technician. Managing day to day production activities related to Wet & Dry etch, Cleans, CMP, Metrology, Process Improvement and Management, while working with innovative MEMs Technology using standard Semiconductor Fabrication facilities such as SVTC.• Improved product development methodology through forward-looking & hands-on technical project management.• Successfully defined new product introduction, evaluation and characterization pans with system engineering team.• Efficiently coordinated Product Qualifications Support (Yield Tracking and Analysis) and Production Release.

I was responsible for leading manufacturing process development projects, using LEAN, 6-Sigma and DOE to improve and sustain plasma etch processing steps, as well as driving resolution of key issues across cross-functional production teams.• Successfully led cross-functional teams to improve process yield and cost. Monitored process performance, initiated and managed major process changes across multiple areas such as lithography, etch, thin films, and metrology.• Developed plasma etch processes - worked on .25u to 45nm process nodes, on both 200mm and 300mm wafers.• Developed a new dual-damascene etch process for 65nm NOR flash, improving process yield and design margin.• Worked with functional managers and tech leads to manage change, mitigate risk and resolve production issues.• Took ownership of defectivity and cost-of-ownership reduction as well as continuous improvement programs.