Thomas Vuong Email & Phone Number

Product development of NEXUS 5000 /6000/7000 support NXOS and XR Platform for Cisco Data Center. Successfully released 5K/6K/7K Switching systems to FCS. Specific products included:• Nexus 6K N6K-C6002 providing 34x40GbE ports included fixed module which can be configured as Ethernet or FC. Nexus 5624 VXLAN providing 12x40G QSFP and 12Q GEM 12x40G ports.• Skywarp –NCS5002 Innsbruck Switching /Routers based on the Broadcom Trident 2+ Metro switch ASIC support 80 x 10G SFP+ 4 x 100G QSFP28 Ports & 100G optical modules.• Sup3 Supervisor card and Line card- modular -34x40G/ 4x100G ports for NEXUS 7000 systems.Responsibility included:• Reviewed the designs with Cross functional team for new product developments. Tasks included identifying and optimizing initial design (DC power, PCB stackups, PCBA layout, Signal Integrity etc..) resulting in low BOM cost target for production release @ >70 % gross profit margin.• Worked with Signal Integrity Engineer and Vendors in finalizing PCB stackups and material required for high speed signal designs (up to 24 layers). Drive the team effort to reduce PCB layer resulting in low cost design.• Performed DFX verification PCB and PCPA CAD layout using Cadence Allegro, Valor and other design tools (Cadence HDL, Orcad etc..) for placement and routing .Work with fab vendors and CM to resolve all critical issues to compliant with Cisco advanced technology requirements.• Worked with CM to drive the evaluation during proto bring up. Drive the Defect Reduction Team (DRT) to identify resolutions to product production issues with OEM supply base• Drive all product Transfer of Information (TOI) and HW debug training with Contract Manufactures.• Work with Diag Eng from initial development to production release phases and drive all manufacturing test and Reliability/ Qualification results prior to production release.

San Jose, California, Us

Responsible for NPI product development of Digital Optical Network systems delivering up to 5Tb/s switching in a single bay. Specific products included Switch Fabric Module (OXM), Universal Tributary Module (OTM), and Tributary Interface-Modules (10G/40G /100G TIMs) support SONET/SDN, OTN, and Ethernet data rates.Responsibilities include:Support the development of new specific products and drives the design to meet manufacturability, quality, reliability, cost and release to production.Design loopback test card for diag/debug testing. The set up can be independently used and released for MFG testing at CM.Work with HW design and drive the evaluation during proto bring up and provide Dev-track bug fixes at FRU level and complex system level. The results found have been reduced the design release cycles to two design iterations.Develop required manufacturing test plans/ specifications included developing Tera-Term test script for functional test at board level to ensure the product release with the goals of zero defects.Work with NPI Program Manager to ensure all product development scheduled deliverable. Drive product designs to meet DFx goals (DFM, DFR, DFT etc.). Review 1st article to ensure product meets mechanical specification requirement. Work with Contract Manufacturing to provide JTag and ICT test fixture. Provide TOIs and training CM test Engineers.Debug complex system level problems. Provide debug test cases and trouble-shooting guidelinesDrive cost reduction plans included PCB redesign and test cost reductions.Drive Mqual for second source plan. Evaluate the results to support EOL and lower cost components. Act as a focal technical product contact and provide technical direction and interface for different groups and CM Partners. Provide guidelines for disposition the yielding issues and support RMA field returns.

Product development of 2Gbits Security HDSIM products targeting for mobile handset and Multi-media market. Responsible includes:• Designed functional blocks and developed FPGA emulating board of Security Embedded Controller and NAND Flash product application for USB/SD Smart Card, SSD Card, Mass storage products ( SATA/PATA).The projects involved multiple IPs circuit designs and verifications on FPGA (Xilinx XC9500series, Virtex-5 XC5LX3300) including 32bits CPU, ARM–CS100, multi-protocols access (ISO7816-3, MMC/SD,USB 2.0, I2C,SPI etc..), Security features (AES,DES), high speed PCI Bus, ANALOG power schemes and DC generators, voltage regulation and high speed NAND Flash Memory Interface. Completed Verilog/VHDL circuit simulations, synthesis, and schematic entry of FPGA designs, Analog blocks include test bench simulation/verifications.• Verified the design and provided test modes generation, timing analysis, and characterizations of Smart card, SSD products. Tools included Arm Jtag Ice Debugger, Protocol System Analyzer Tester (Testmetrix), ADS, Verilog simulation, and Modelsim• Product testing/characterization development on Agilent/Verigy MS5500 and 93K ATE system for testing SIM card, SSD Card products (CPU Controller + Nand/NOR Flash) (2Gbits) and analog functional blocks. Characterized performance on both IC and system level with developed diagnostic firmware (IPL). Verifications for mobile handset applications with OMAP designs. Product released with low cost target within 6 sigma designs.

Head of the product development teams responsible for development of Digital RF/Microwave Radio systems (PTP, PMP) target for Wireless Internet Access. Responsible included:• Designed RF /Microware Transceiver System (350 MHz -3.5 GHz frequencies). These designs included RF Filters, PLL Synthesizers, RF power amplifier, RF Mixers, LNAs, Up/Down converter, AGC,RSSI, Diplexers, IQ Modulator & Demodulator for the downlink and uplink respectively. Designed outdoor radio unit provided 3.5 watt RF Power amplifier and driver for the downlink at 800MHz to 2.5 GHz.• Designed High Speed Analog and Digital broadband modems (512k/ 2-4MBPS) used for voice/data and video applications. The design included modulation and demodulation using 2-FSK, OQPSK, 16QAM modulation technology; high speed ADCs/DACs, AGC, Data/Clock recovery, G.703/RS232/V.35/ and Ethernet switching interfaces. Circuit capture and PCB & mechanical design layout (load boards, RF shielded box, chassis, etc…). Tool includes MATLAB/Simulink, Xilinx ISE, ORCAD (PSICE) schematic and layout, CADENCE allegro, AUTOCAD.• Developed LCD modules for system diagnostic and signal monitoring (BER, SSI, TX power etc...)• Developed board architecture for high speed data interface Cards ( RS-232,RS-422, Ethernet/Optical Interface) • Set up and performed automated test of all RF modules, high-speed modems, includes characterize low distortion, Phase Noise, Noise Figure, EVM, IMD, EMI and RFI measurements.• Provided technical testing support for product development of high speed data convert DAC/ADC Mixed Signal products and Remote Radio Head System (850 MHz, 2.1 GHz ) for CDMA2000 /GSM/EDGE base stations

Manage the team (4) with responsible for Testing and Product development of Wireless products (RFID, PLL Synthesizer), CPLDs, Microcontrollers, Serial NAND FLASH Memory products. Responsible includes:Qualified and delivered new products from the design phase to the qualification phase, and released final products into manufacturing. Leaded cross-functional team for first silicon debugging.Developed characterization/ and test programs for products on Tri-Temp and Advantest 5375, Teradyne 783 systems. Designed and optimized test flows and implemented parallel testers in final test resulting in 50% cost reduction. Established head characterization guideline for testing group which was used in overseas FAPerformed yield analysis and product characterization resulting with the robust design which manufacturing yield was above target. Product cost went down by 15%.Provided to Product engineers and overseas manufacturing the key technical direction and training which improved substantially the product final yield.Leaded the GOP team for product lines cost reduction. Projects involved in die size-sink, and test time reduction to 30%.