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PROFESSIONAL GOAL:Manage/lead or be an individual contributor on a highly motivated team that is focused on delivering forward-looking products or technologies that impact the world.
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Component Thermal Design ManagerIntelHillsboro, Or, Us -
Liquid Cooling Design ManagerIntel Corporation Apr 2022 - Sep 2024Santa Clara, California, UsLeading a team to influence the Datacenter industry to adopt liquid cooling; Direct Liquid Cooling (DLC) and immersion. Our team strives to mature these technologies to provide easy adoption by our customers. -
Component Thermal Design ManagerIntel Jun 2015 - Apr 2022Leading a team of thermal engineers to influence the datacenter ecosystem with leading edge CPU component thermal solutions. Team is responsible for ensuring CPU silicon roadmap is not thermally limited via innovative thermal solutions and enabling future thermal technologies to exceed the needs of the datacenter roadmap including air and liquid cooling solutions. Developed thermal technology roadmap that utilized technology readiness indicators adopted from NASA.
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Ultrabook Advanced DesignIntel Corporation Apr 2014 - Jun 2015Santa Clara, California, UsManaged/led a team of electrical engineers to deliver forward-looking board-level solutions for each of the five Client roadmap product segments: High-end Desktop (HEDT), Desktop AIO/uATX/pAIO, Mobile Halo, Mobile Mainstream, and Mobile Small FF. The team was responsible for delivering board layout solutions involving the processor complex (power, memory and processor signal breakout) that meets the unique requirements of each of the product segments. The team focused on CPU products three-to-five years out on the roadmap. -
Desktop Package Design Manager/Technical LeadIntel Corporation Sep 1995 - Apr 2009Santa Clara, California, UsManaged team of up to eleven package design engineers to flawlessly deliver over 100 production Desktop package designs from Prescott (2004) to Haswell (2009), including the first dual-core package (Smithfield) and quad-core package (Yorkfield). Team was responsible for ensuring microelectronic packaging meets the design, cost, and assembly requirements. Personally led teams to define and productize Desktop socket footprints including 370 pin (1998), 423pin (1999), 478 pin (2000) and 775 pin (2001). -
Customer Service Technician-Supercomputer DivisionIntel Corporation Mar 1992 - Sep 1995Santa Clara, California, UsManaged a customer service lab comprised of seven technicians that provided board and system-level debug of customer returns of supercomputer components; CPU boards, I/O boards, memory modules, backplanes, host system, SCSI modules, and door display LED panels. Familiar with hypercube and mesh routing configurations. System administration of UNIX-based host controller and proprietary UNIX-based OS. UNIX scripting with Sed/Awk -
Engineering TechnicianIntel Corporation Jan 1989 - Mar 1992Santa Clara, California, UsEngineering technician for Multibus Development team. Schematic development for Multibus baseboard and memory module, 8051 code development, board-level debug, and environmental testing.
Tim Gates Skills
Tim Gates Education Details
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Oregon Institute Of TechnologyComputer Engineering
Frequently Asked Questions about Tim Gates
What company does Tim Gates work for?
Tim Gates works for Intel
What is Tim Gates's role at the current company?
Tim Gates's current role is Component Thermal Design Manager.
What is Tim Gates's email address?
Tim Gates's email address is tg****@****tel.com
What is Tim Gates's direct phone number?
Tim Gates's direct phone number is +197399*****
What schools did Tim Gates attend?
Tim Gates attended Oregon Institute Of Technology.
What skills is Tim Gates known for?
Tim Gates has skills like Computer Engineering, Semiconductors, Visual Basic, Cadence Schematic Capture, Cad, Xilinx, Robotics, Management, Program Management, Memory, Pc, Component Development.
Who are Tim Gates's colleagues?
Tim Gates's colleagues are Binfen Zhang, Taphne Sisto, Tianyou Li, Mayank Gautam, Karen Dickinson, Xue Qi Lim, Sushma Chiluvuri.
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