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16+ years of engineering management experience for both R&D and Manufacturing environments. Managed successful programs for MEMS technology, plastic/glass display technology, and inkjet technology that includes CMOS wafer processing. Extensive work with Asian companies (Korea, Taiwan, Japan, & China) for both development and production. Managed teams of diverse engineers with background in optics, electronics, materials, & chemistry. Management Strengths: Innovation leader, Systems view of technology & business, Strategic thinker, Co-Innvoation with Supply Partners, Management process creator, Concurrent Engineering Methodology (Co-development & manufacturing), Partnership-Stakeholder relationship builder, Early-adopter mentality, Values and creates team diversity.Goals: Develop new strategic business opportunities that leverages the capabilities of an engineering organizaiton. Colloborate with the world's leading technology and manufacturing companies to co-innovate new technology and deliver quality products to customers.
Crown Electrokinetics Corp.
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CtoCrown Electrokinetics Corp. Jan 2016 - PresentStart-up company based on thin-film plastic roll-to-roll technology that can be used for electronic smart windows as well as other application where electronic control of ambient lighting is needed.
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Director Display EngineeringAltierre Oct 2012 - Jul 2015San Jose, Ca, UsResponsible for both development of new display technology and manufacturing of current displays at multiple Asia suppliers. -
Senior R&D Engineering ManagerHewlett-Packard 2005 - Oct 2012Houston, Texas, UsSenior R&D Engineering Manager – HP Imaging & Printing Group (IPG)• Managed HP MEMS accelerometer project applied to seismic testing for oil and gas exploration.Created new electronic reflective display technology and business through “Open Innovation” methodology.• Developed working relationships with 1st tier and 2nd tier flat panel makers as well as key material/equipment suppliers in the world through HP’s reflective display technology and backplane transparent transistor technology. • Evaluated new (>1$B) solution business opportunities using Co-Innovation Model working with large >$20B businesses in a variety of fields of interest.• Solar Panel Project – DARPA VHESC (Very High Eff. Solar Cell) – Project manager. Achieved over 34p efficiency at a low cost per area. Both Si & III-V multi-junction cells to maximize solar collection in a concentrator design. -
College RecruitingHewlett-Packard 1995 - 2010Houston, Texas, UsCollege Recruiter: Active recruiter as Team Leader on the HP-Cornell recruiting team.
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R&D Engineering ManagerHewlett-Packard 2000 - 2004Houston, Texas, UsR&D Engineering Manager – Inkjet Pen Development • Guided and supported innovation required for successful development of scalable inkjet technology (gen 4) for HP Inkjet printers.• Strategic planning and execution of Technology Roadmap for inkjet printheads.
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Manufacturing & Development Engineering ManagerHewlett-Packard 1995 - 2000Houston, Texas, UsManufacturing & Development Engineering Manager – HP Inkjet Printheads • Created teams of engineers that both developed new product capability and maintained manufacturing excellence for new 200mm silicon fab. Developed new management processes to enhance organizational effectiveness.• Managed process equipment budget for over $50M of capital assets• Hired and coached teams of new & diverse engineers. • Managed yield improvement, process control implementation, process capability improvement, and worldwide fab equipment and process convergence.• Participated in production line management team which included fab utilization improvement, and new process/product transfers from R&D.
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Senior Manufacturing & Development EngineerHewlett-Packard 1993 - 1995Houston, Texas, UsSenior Manufacturing Development Engineer• Change agent for Process Control in MEMS 200mm fab.• Leadership through action and mentoring of engineering staff• Developed a documentation strategy for all fab documents and created templates for on-line viewing of process control documents.• Implemented process options for new inkjet fab to minimize the equipment set and product cycletime. Worked with R&D to determine the impact of various technology options on manufacturing fab capacity and cost.• Contributed to the development of fab cross-functional teams (engineering, production, and maintenance) for the new inkjet fab. Define the team metrics, team responsibilities.• Team leader of dry-etch acquisition team through entire acquisition process that included schedule, budget, tool evaluation, purchasing, engineering, installation and RTP of plasma etch tools for the new Inkjet fab.
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Senior Manufacturing & Development EngineerHewlett-Packard 1992 - 1993Houston, Texas, UsSenior Manufacturing Development Engineer - CMOS Fab • Strategic Development of future fab capability in HP.Member of 0.35um CMOS process program management team for new 200mm fab. • Implemented cross-functional projects that reduced the cost of manufacturing by analyzing the Cost – of – Ownership (COO) for various equipment and processes in the 150mm fab to reduce manufacturing spending and increase equipment utilization and fab capacity.
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Manufacturing & Development EngineeringHewlett-Packard 1982 - 1992Houston, Texas, UsManufacturing Development Engineer – CMOS Fab• Implemented a quality program using statistical process control in the 150mm CMOS wafer fab. Established the objectives, tools, and timelines of the program for the engineering and production organizations and executed the objectives to the required timelines.• Constructed the original 0.8um CMOS full process flow for wafer starts in a new 150mm-wafer fab.• Demonstrated inter-divisional leadership by obtaining a common set of equipment and process specification goals between all HP Integrated Circuits sites.R&D Process Engineer - CMOS Fab• Developed processes for two-level interconnect for the 1.3um CMOS technology.• Developed a self-aligned silicide process on shallow junctions for the 1.3um CMOS technology.
Tim Koch Skills
Tim Koch Education Details
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Stanford UniversityMaterial Science & Engineering -
Cornell UniversityMaterial Science & Engineering
Frequently Asked Questions about Tim Koch
What company does Tim Koch work for?
Tim Koch works for Crown Electrokinetics Corp.
What is Tim Koch's role at the current company?
Tim Koch's current role is CTO - Crown Electrokinetics Corp..
What is Tim Koch's email address?
Tim Koch's email address is tim.koch@hp.com
What is Tim Koch's direct phone number?
Tim Koch's direct phone number is (650) 857*****
What schools did Tim Koch attend?
Tim Koch attended Stanford University, Cornell University.
What are some of Tim Koch's interests?
Tim Koch has interest in Ultimate Frisbee, Hiking And Fishing In Montana, Piano.
What skills is Tim Koch known for?
Tim Koch has skills like Cross Functional Team Leadership, Program Management, R&d, Engineering Management, Product Lifecycle Management, Design Of Experiments, Product Development, Product Management, Six Sigma, Testing, Software Development, Manufacturing.
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