Tim Lu Email & Phone Number

Hsinchu, Tw

Taiwan

Service Head of Epitaxy, Thermal ALD and PE ALD in TaiwanService and Sapre Business Development P&L ControlNew Business Development (Refurbishment, Clean...)

Phoenix, Arizona And Hsinchu, Taiwan

Epitaxy and HiK/MG ALD Business of Taiwan and Mainland China

Taiwan

1. Preside over >1.2B Business and >200 Engineers Technical Supporting Team Management of F15B N10 Ramping2. Response on Customer Relationship, Account Management, Production Ramping... all Issues in Taichung Site3. Identify and Develop Product Manager and Product Lead Champion for Group. 4. Early Involve New Technology Transfer with Dedicated Resource.

Taiwan

1. Preside over >0.8B Business and >150 Engineers Technical Supporting Team Management of F15A N28 Ramping2. Fast Ramping of 200 Systems Installation with Average 30% Cycle Time Reduction. Repeatable Installation Performance by SOP Build Up and <5% Installation Delay. 3. Big Data Analysis and Data Mining --- Implemented Solution in customer site to predict and solve problems in CMP, CVD and EPI (PM success rate, Tool health index, Tool sigma matching, FDC fingerprint/control, Process optimization, Defects reduction, Throughput improvement…4. Field Audit of Parts Quality/Failure Finding/SOP Build Up with AMAT’s Supplier Site in CMP, CVD, EPI, Anneal and MDP. On site supplier field audit in Japan and US.

Taiwan

1. Response on >150M/Yr Repeat Order and >50M New Product Penetration Business.2. Enlarged Management Scope from CVD to Anneal and EPI Product. Successfully Repeated and Participated Management Skill of Team Building and Empower in New Products. 3. Re-build Epitaxy Team by Empowering and Delegation. Introduced Temporal Engineer System to Share Routine Work Load from Sr. Engineers. Temporal Engineer System also Became the Major Engineer Manpower Hiring System in AMT.4. Develop Deputy in Anneal Team and Start Involve Urgent Issues as a Fireman

Taiwan

1. Response on >300M/Yr Repeat Order and >80M New Product Penetration Business2. Lead a Technology Team with 18 Engineers to Response All Dielectric Thin Film Applications from R&D to Volume Product, Hardware to Process and 0.25um to 22nm. 3. Won 100% Market Share in Gap Fill Application from 0.25um to 32nm over 10 years. Kick out Competitor through Head to Head Competition in 2006.4. Product Improvement in Parts Reliability, Wafer Output, Defect Performance and Overall Cost Reduction. 5. Lost Market Recovery --- Over 80 Systems with USD >400M Business Return (0.18/0.15um).6. Cross Account Management --- Response on all Taiwan Customers in Thin Film Applications (TSMC, UMC, PowerChip, Nanya etc…)

Taiwan

Key Product Penetration - Clear Won in 0.18/0.15um HDP FSG, 80 Systems with USD >400M Business Return 1999- Kept 100% Market Share in Gap Fill Application from 0.25um to 32nm over 10 Years, 1999 to Today- Kept 100% Market Share in Low k Application from 130nm to 20nm over 10 Years, 2002 to Today

Taiwan

Account Business Key Index Review and MonitorAccount GM Presentation Materials PreparationRegional Internal Quality Review and Audit

Taiwan

Master'S Degree, Science In Materials Engineering,

Activities and Societies: Inter of UMC Fab II PVD Group, Summer 1996• Materials Aspects of GaAs and InP • VLSI/ULSI Semiconductor.

Bachelor Of Science In Physics, Photoelectric