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1. Account P&L Management and Control- 5 Years Business Plan - Customer Channel/Champion Build Up and Maintenance- Response of TWN Service & Spare Revenue and Growth Margin- Cross Function Communication, Cooperation and Coordination- Product Strategy and Business Planning, - Revenue Forecast, Execution and Delivery 2. Product Market Share Sizing, Growth, Maintenance and Recovery (Low k, EPI, ALD…)3. Product Penetration, Development and Continuous Improvement (0.5um to 5nm)4. Team Building and Change Management- Build Up and Co-lead a >300 Hardware/Process/Software/Sales Team 2016 -2021- Response on 5 Major Product Line (CMP/CVD/EPI/FEP/MDP) with Contribution of >0.8B in 2012 - 20165. Big Data Analysis and Data Mining 6. Field Audit of Quality/ISO/FDC/0.5 Sigma Matching/SOP and COA
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Taiwan Region Technical DirectorAsmHsinchu, Tw -
Taiwan Service HeadAsm Aug 2018 - PresentTaiwanService Head of Epitaxy, Thermal ALD and PE ALD in TaiwanService and Sapre Business Development P&L ControlNew Business Development (Refurbishment, Clean...) -
Technical Director Of Global Product MarketingAsm Aug 2016 - Aug 2018Phoenix, Arizona And Hsinchu, TaiwanEpitaxy and HiK/MG ALD Business of Taiwan and Mainland China -
Deputy DirectorApplied Materials Jun 2013 - Jul 2016Taiwan1. Preside over >1.2B Business and >200 Engineers Technical Supporting Team Management of F15B N10 Ramping2. Response on Customer Relationship, Account Management, Production Ramping... all Issues in Taichung Site3. Identify and Develop Product Manager and Product Lead Champion for Group. 4. Early Involve New Technology Transfer with Dedicated Resource. -
Sr. Product Manager In Taichung SiteApplied Materials Dec 2011 - Jun 2013Taiwan1. Preside over >0.8B Business and >150 Engineers Technical Supporting Team Management of F15A N28 Ramping2. Fast Ramping of 200 Systems Installation with Average 30% Cycle Time Reduction. Repeatable Installation Performance by SOP Build Up and <5% Installation Delay. 3. Big Data Analysis and Data Mining --- Implemented Solution in customer site to predict and solve problems in CMP, CVD and EPI (PM success rate, Tool health index, Tool sigma matching, FDC fingerprint/control, Process optimization, Defects reduction, Throughput improvement…4. Field Audit of Parts Quality/Failure Finding/SOP Build Up with AMAT’s Supplier Site in CMP, CVD, EPI, Anneal and MDP. On site supplier field audit in Japan and US. -
Sr. Product Manager Of Epi And AnnealApplied Materials Oct 2009 - Dec 2011Taiwan1. Response on >150M/Yr Repeat Order and >50M New Product Penetration Business.2. Enlarged Management Scope from CVD to Anneal and EPI Product. Successfully Repeated and Participated Management Skill of Team Building and Empower in New Products. 3. Re-build Epitaxy Team by Empowering and Delegation. Introduced Temporal Engineer System to Share Routine Work Load from Sr. Engineers. Temporal Engineer System also Became the Major Engineer Manpower Hiring System in AMT.4. Develop Deputy in Anneal Team and Start Involve Urgent Issues as a Fireman -
Product Lead And Manager Of CvdApplied Materials May 2004 - Oct 2009Taiwan1. Response on >300M/Yr Repeat Order and >80M New Product Penetration Business2. Lead a Technology Team with 18 Engineers to Response All Dielectric Thin Film Applications from R&D to Volume Product, Hardware to Process and 0.25um to 22nm. 3. Won 100% Market Share in Gap Fill Application from 0.25um to 32nm over 10 years. Kick out Competitor through Head to Head Competition in 2006.4. Product Improvement in Parts Reliability, Wafer Output, Defect Performance and Overall Cost Reduction. 5. Lost Market Recovery --- Over 80 Systems with USD >400M Business Return (0.18/0.15um).6. Cross Account Management --- Response on all Taiwan Customers in Thin Film Applications (TSMC, UMC, PowerChip, Nanya etc…) -
Technologist Of CvdApplied Materials Feb 2002 - May 2004TaiwanKey Product Penetration - Clear Won in 0.18/0.15um HDP FSG, 80 Systems with USD >400M Business Return 1999- Kept 100% Market Share in Gap Fill Application from 0.25um to 32nm over 10 Years, 1999 to Today- Kept 100% Market Share in Low k Application from 130nm to 20nm over 10 Years, 2002 to Today -
Account Adminstration ManagerApplied Materials May 2000 - Feb 2002TaiwanAccount Business Key Index Review and MonitorAccount GM Presentation Materials PreparationRegional Internal Quality Review and Audit -
Process Engineer Of CvdApplied Materials May 1997 - May 2000Taiwan
Tim Lu Skills
Tim Lu Education Details
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University Of Southern CaliforniaScience In Materials Engineering, -
Fu Jen Christian UniversityPhotoelectric
Frequently Asked Questions about Tim Lu
What company does Tim Lu work for?
Tim Lu works for Asm
What is Tim Lu's role at the current company?
Tim Lu's current role is Taiwan Region Technical Director.
What is Tim Lu's email address?
Tim Lu's email address is ti****@****asm.com
What schools did Tim Lu attend?
Tim Lu attended University Of Southern California, Fu Jen Christian University.
What are some of Tim Lu's interests?
Tim Lu has interest in Ski And Self Traveling, Road Biking, Marathon.
What skills is Tim Lu known for?
Tim Lu has skills like Semiconductor Industry, Product Management, Semiconductors, Team Building, Cross Functional Team Leadership, Management, Product Marketing, Product Development, Engineering, Electronics, Complex B To B Project Management, Semiconductor Process Technology And Manufacturing.
Who are Tim Lu's colleagues?
Tim Lu's colleagues are Mark Gonzales, Mark Langham, Johan Eklund, Daniel Ariztia Azkarate, Haseok Jang, Seoyun Kim, Takaya Ono.
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