Tim Tran Email & Phone Number

Over 20 years experience enabling the industry's best server & workstation platforms as a Thermal Engineer with a strong technical background in heat transfer, electronics cooling and knowledge of Servers and Clients for the Data Center Platform Applications Engineering Division - Responsible for Xeon processor SKU stack development, thermal specification setting definition, junction temperature projection for BinSplit/Yield analysis and frequency projection for Intel XEON processors. - Setting direction and communicating strategies for thermal management that support Intel processors, chipsets, and other platform components, driving expanded high performance processors to POR to be available on the roadmap- Enable OEMs, TEMs, ODMs, the ecosystem and other customers to quickly ramp these new platforms- Setting direction and communicating strategies for thermal management that support Intel processors, chipsets, and other platform components- Development and validating components/system level cooling solutions for Xeon Server systems through both simulation and testing- Support multiple platforms with traditional and advanced cooling technologies required to meet the thermal challenges of increasing power density and power/performance requirements on future servers- Working with customers to ensure design feasibility, robustness, and launch readiness- Representing customer technical needs in new product development teams- Predicting and resolving technical issues associated with platform integration - Developing customer communication and collateral including design guides, specifications, training material, test tools, and models that support Intel's and customers' reliability and schedule goals

Listed skills include Semiconductors, Testing, Debugging, Cross Functional Team Leadership, and 13 others.

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  University Of Washington

  3.5 Gpa