Manage the project from NPI to HVM, resolve and coordinate the technical issues from customer and internal team. Manage customer new project from NPI to production, including DOE, ES, qual build, reliability…etc.  Product type is mainly as below: LGA: FPS /MEMS product BGA: Memory product QFP:RF IC WLCSP: GPS product FCCSP: 5G base station Coordinate on the implementation of customer’s specific technical requirement. Support AM/AE on technical issues during customer visit the factory. Driving 8D/solutions for issues that encountered during production.  Support factory to achieve and maintain assembly production goal.

Manage design team in assembly engineering department to provide excellent design support to meet the customer needs and internal development requirement.Job Function Summary: Review customer design and highlight the potential issue and required tooling. Provide feasibility review based on customer requirements. Drive internal design rule to meet existing and future customer's need. Drive Supplier's technology to meet UTAC and Customer defined goal. Generate bond diagram, Substrate (BGA, LGA), LF (QFN), POD and strip drawing using Cadence APD, Auto CAD and CAM350 Gerber tool. Hold design review meeting with internal parties and/or customer. Manage design & maintain design file databaseSoftware Auto CAD, CAM350 Gerber tool, Cadence APD.

From 2006 to 2008, mainly focus on QFP, QFN, TAPP package, from 2008 to 2013, mainly focus on BGA, LGA, TLA, SIP-HLA package. Job Function Summary: Review customer design and highlight the potential issue and required tooling. Provide design feasibility review based on customer requirements. Generate bond diagram, Substrate, LF, Stencil, Heatsink, POD and strip drawing. Hold design review meeting with internal parties and/or customer. Search the related design information from Design database. Prepare and Review design documents, procedure and Part Number Request. Summary design status and complete monthly report. Review Supplier design and highlight the potential issue. Attend the internal or external for new design/process/substrate technology.Software Auto CAD, CAM350 Gerber tool, Cadence APD.