Tim Mate Email & Phone Number

Austin, Texas, United States

Documented procedures for lab equipment and trained Technicians on SOP for the lab. communication with internal customers and external vendors, equipment/supply ordering and inventory management. Quality Control analysis incorporating deconstruction of components, welds, rivets and adhesive. Torque and compression testing of fasteners. Validation or failure analysis of product process or changes.

Round Rock, Texas, United States

Working in an AS9100/ISO9001 certified and ANSI/ESD S20.20 facility I designed and ordered solder ball tooling incorporating component spec sheets and through supplier communication. Supervisor for the circuit board rework line which incorporated logistics, problem solving skills and customer communication. Compiled and documented procedures and processes for best practice rework activities. Programmed the SRT rework equipment with the correct solder reflow profile according to board mass and solder alloy. Inventory control and ordering of consumable IC tape & reel and trays. ESD testing of all process equipment and tools on shop floor. Equipment calibration documentation and management.

Austin, Texas Area

New product qualification requiring a vast array of analytical and environmental equipment. Failure Analysis on returned products to determine the root cause for the failure and devise a resolution with follow-up analysis. Measured components and assemblies using the Keyence VHX and Nikon iNEXIV digital measurement microscope with a comparison made to the spec sheet. Developed and fabricated testing jigs and fixtures to test unique products and to facilitate the test sample preparation. Designed and fabricated a fixture to cut samples for mechanical testing in the laboratory and factory which reduced sample preparation time by 90% over the previous method in addition to increasing safety. Experienced in following EIA & UL documented standards.

Austin, Texas Area

Created detailed teardown reports on consumer electronic products requiring entry of 4,000 data points. This including product research (data mining), disassembly process, power measurements, system analysis, IC component and MEMS identification, component count (discrete, modules and connectors), analyst observations, electronic block diagram and line item BOM with cost for the device components. Helped grow the business from an 8-person start-up company (Portelligent) to a global organization (TechInsights).• Created and updated costing software tools enabling BOM costing accuracy.• Updated report templates and tools which decreased errors and reduced report compilation time by 30% while increasing comprehension and professionalism.• Updated equipment and supplies decreasing teardown time and saving the organization $180K/year.• Trained new employees on the teardown process, providing hands-on experience allowing new staff to contribute to the product teardown immediately.• Presented at 2016 Embedded Systems Conference in Boston, lecturing on Wearable teardowns.• Teleconferenced Q & A sessions with customers who requested custom teardowns with a follow-up conference or had general questions.

Austin, Texas

Developed and tested Tape Ball Grid Array (TBGA) packages and ink-resistant Liquid Crystal Polymer (LCP) flex circuits for inkjet cartridges. Developed a competitive analysis program within the division and provided quarterly presentations on my analysis.Performed the plating and etching of polyimide circuit, adhesive research, circuit lamination, solder ball placement, electrical, mechanical and environmental testing, compiling results in a spreadsheet and presenting to team.• Developed a continuity tester, held as trade secret, for ball grid array (BGA) packages, utilized during environmental testing.• Solved defect in solder ball adhesion, identifying problems with via slope and solder ball size.• Resolved package surface contamination issue in production phase, analyzing process and identifying improper rinsing as root cause.• Developed ink-resistant circuit for inkjet cartridges using Liquid Crystal Polymer (LCP) substrate.• Developed test and measurement plan for LCP circuits, which involved automated measurement and electrical / mechanical testing, providing failure analysis, recording results, and presenting results to team.• Performed competitive analysis on flexible circuits, inkjet cartridge knock-offs and inkjet printers which included photos, data analysis, SEM and EDAX images and measurements. I collected and compiled this data into reports and spreadsheets which I presented to the division on a quarterly basis.• Member of the 3M safety committee with responsibility of monitoring division laboratories.