Tim Mate Email & Phone Number

Austin, Texas, United States

Documented procedures for lab equipment and trained Technicians on SOP for the lab. communication with internal customers and external vendors, equipment/supply ordering and inventory management. Quality Control analysis incorporating deconstruction of components, welds, rivets and adhesive. Torque and compression testing of fasteners. Validation or.

Round Rock, Texas, United States

Working in an AS9100/ISO9001 certified and ANSI/ESD S20.20 facility I designed and ordered solder ball tooling incorporating component spec sheets and through supplier communication. Supervisor for the circuit board rework line which incorporated logistics, problem solving skills and customer communication. Compiled and documented procedures and processes.

Austin, Texas Area

New product qualification requiring a vast array of analytical and environmental equipment. Failure Analysis on returned products to determine the root cause for the failure and devise a resolution with follow-up analysis. Measured components and assemblies using the Keyence VHX and Nikon iNEXIV digital measurement microscope with a comparison made to the.

Austin, Texas Area

• Created detailed teardown reports on consumer electronic products requiring entry of 4,000 data points. This including product research (data mining), disassembly process, power measurements, system analysis, IC.
• Created and updated costing software tools enabling BOM costing accuracy.
• Updated report templates and tools which decreased errors and reduced report compilation time by 30% while increasing comprehension and professionalism.
• Updated equipment and supplies decreasing teardown time and saving the organization $180K/year.
• Trained new employees on the teardown process, providing hands-on experience allowing new staff to contribute to the product teardown immediately.
• Presented at 2016 Embedded Systems Conference in Boston, lecturing on Wearable teardowns.

Austin, Texas

• Developed and tested Tape Ball Grid Array (TBGA) packages and ink-resistant Liquid Crystal Polymer (LCP) flex circuits for inkjet cartridges. Developed a competitive analysis program within the division and provided.
• Developed a continuity tester, held as trade secret, for ball grid array (BGA) packages, utilized during environmental testing.
• Solved defect in solder ball adhesion, identifying problems with via slope and solder ball size.
• Resolved package surface contamination issue in production phase, analyzing process and identifying improper rinsing as root cause.
• Developed ink-resistant circuit for inkjet cartridges using Liquid Crystal Polymer (LCP) substrate.
• Developed test and measurement plan for LCP circuits, which involved automated measurement and electrical / mechanical testing, providing failure analysis, recording results, and presenting results to team.