Tim is currently the 2024 IEEE USA President Elect. He is the past IEEE Region 6 (Western US) Director and member of IEEE Board of Directors (2021-2022). He is a Boeing Technical Fellow in advanced microelectronics and packaging. Tim's interests in IEEE activities that promotes the use of technology that benefit humanity. Currently, Tim is Vice-Chair of the IEEE Future Networks Technical Community. He is the Co-Chair of the IEEE Heterogenous Integration Roadmap TWGs for mm-waves and Aerospace & Defense. He was the IMS2020 General Chair. Previously he was the Chair of the IEEE Internet Inclusion track for the IEEE Internet Initiative, the Chair for IEEE SIGHT and and the Chair of the IEEE Humanitarian Activities Committee Projects. In 2023, Tim’s priorities for the IEEE include leveraging the US CHIPS and Science Act of 2022 programs to promote semiconductor workforce development, revitalization of IEEE membership in the US, industrial engagement, and the support of Diversity, Equity and Inclusion. He is leading the expansion of the IEEE MOVE program for emergency communications for disaster relief to Western US regions. To volunteer for MOVE, visit https://move.ieeeusa.org/ or contact me.
Listed skills include Simulations, Rf, Program Management, Engineering Management, and 11 others.