I hold a Bachelor's Degree in Electrical and Electronics Engineering. In my recent role as a Senior Assembly Process and Equipment Engineer at Intel Products Vietnam, I have amassed over seven years of experience with the Thermo-Compression Bonding (TCB) method in the Die Attachment process. My expertise extends to data analysis, international transfer and training, initiating operations in parts of the factory, and developing tools and production strategies for controlling limits across multiple products. Additionally, I have played a pivotal role in elevating the skill sets of technician teams, focusing on TCB tool proficiency, production enhancement, and quality improvement. This includes introducing new hardware designs, software updates, optimizing bond profiles for TCB tools, and contributing to technical papers and events.