See TAS Capability Sheet for more detail.Technical Analysis, Program Management, Reliability Analysis and more.

Director of Mission Assurance – Guru over Parts & Materials, Electronics Packaging, Mission level contamination, safety, and reliability. Commercial through Tier 1 Space Products• Executed process development, training, and processes to get Jacobs AS9100 certification achieved March 2023. Moved a mostly non-space group (heavy into R&D) into Production Space and Operations.• Released over 120 procedures and 60 forms with the process owners and relevant training programs. Performed several internal audits, process improvements, and team learning events.• Worked with several programs to ensure Mission Assurance and Space Readiness. This included Systems SDRLs, Verification Matrices, Parts and materials plans, Contamination, Reliability and Quality Plans, Configuration Management, Production set-ups and other system level requirements through DOORS and SAP software. Highlighted here are significant communication, planning, organizational support, and production support. Provided Math and Estimating processes for large programs.• Achieved compliance using internal audits with nonconformance reporting and process improvements. Used communication, planning, training, and working directly with all levels of the organization.• Used best practices methodologies to create processes where there weren’t any prior to my starting with the company. Set up Estimating, Planning, and organizational structure where needed in Production Support, Inspection, PM&P, and System Reliability and verification matrices.• Worked with Program Management, Engineering, Manufacturing, Electrical CAD/Mechanical CAD, Inspection and Receiving, Purchasing, Software, Integration and Testing, Purchasing, Configuration Management, and Quality to simplify the processes, provide process improvements, but still provide required rigor.• Led and trained a new team of engineers in Parts, Materials and Processes, PMPCB activities, and Non-Standard Parts Approval.

TAS Consulting, Thermal Analysis Systems, Mendon, NY – 2010 t0 2020 – Chief Technical Officer Harsh Environment Electronics Reliability Expert Consulting for Government Primes, Defense, Automotive, and High-Reliability Electronic• Executed Sole source to Government Primes to provide Electronics Packaging Reliability Expertise. Provided marketing plan, created proposals and quotations, performed harsh environmental analysis and testing, solder cccccis, test plan creation, test plan execution, design consulting, procedure writing, and organizational training.• Improved R&D efforts and Math/Analyses for small start up companies investigation new business.• Performed Solid Works CAD and Analysis for clients to add new capability now bringing in millions. Has spoken and taught at IMAPS Conference as technical expert in Reliability, Circuit Boards, and Electronics Packaging.• Provided inputs to a Space Manufacturing company to create a new factory.http://solderfatigue.wordpress.com/www,thermalanalysissystems.com/

• Executed proposals, won, and pursued study phase into a new area. This revolved into a new program that I completed within schedule and budget. Proposed 3rd quarter study that was awarded late 2008 and completed successfully. This study moved into an active proposal where we won due to the innovation and cost reduction seen in the payload. The customer needed a “Purple Cow,” and we gave it to them. This customer wanted a no-frills approach for quick tactical missions. We gave them an interchangeable payload with a reconfigurable software choice of four mission sensors in a small satellite format. • Worked with both the Competitive Intelligence and Business Development Groups to learn customer focuses, adjacent markets, and the tools available for this type of research. Have personally done price-to-win presentations, ghosting themes, and reviewed competitors and their bidding practices.• As Program Manager, successfully doubled a government study contract focusing on the next generation of satellites. Executed the program with stellar performance warranting outstanding customer feedback, especially in responsiveness and scheduling. Excellent customer communication required for this fast-moving, very technical program. • Supporting on-going proposals in the areas of System Architecture including software, RF, Optical Bus, Data Compression/transfer, EMI/EMC, Packaging, PM&P, Reliability, Manufacturability, Accessibility, Testability, Thermal, Vibration, and Supplier Subcontracts. • Interacted directly with customers as the ITT spokesperson for workmanship, materials, thermal, RF Grounding, electronics packaging, and quality issues. Responsible for proactively steering several processes focused on Packaging, Electrical, CAD, Parts & Materials, and system level architecture.• Recognized technical expert in Packaging and System Design, Design for Manufacturing with 21 patents.

Lab Head and Packaging Producibility ExpertDeveloped Auto Industries’ first underhood BGA (Ball Grid Array). Advanced packaging concepts with knowledge of solder fatigue and creep. Submitted 8 different patents in the areas of RF Packaging, Thermal Packaging, and Electronics Processing.•Responsible for Materials and Component Development lab for Chrysler Advanced Packaging for Underhood Electronics - Yearly budget was close to $10M.•Developed flexible board and thermally conductive film/adhesive usage for production•Developed underhood BGA for 1999 automobiles and was extended into more types of modules in 2002 and then again in 2004. •Development of production metrics that could be gated as the life of the product continued and was expanded.•Qualified new potting for production use – exit criteria and usage was so phenomenal to solder fatigue improvements that she was invited to speak at SAE convention for International Suppliers.

Product Team Manager for NASA AFE Satellite and Launch Rail Car Support VehicleDeveloped several databases for reliable/quick information retrieval for historical and current design information. Developed environmental pollutants tracking database for propulsion emissions.•Project Manager responsible for all mechanical, structural, and thermal project areas for NASA AFE Satellite.•Tiger Team Lead across 4 locations (US and Canada) for system maintenance and reliability concerns. •Designed facility pressurized line addition for water system under temperature loading. •Designed rig for testing hydrazine expulsion concepts. •Reviewed Boeing designs for Space Station in the areas of manufacturability, packaging, and reliability.

Senior Engineer & Team Lead – Aerospace Structures, Thermal, and new development of materials•Worked on spacecraft payload responses utilizing ANSYS and PATRAN for 2D and 3D structural analysis model.•Showed the benefits of new platelet hip-bonding process and specialized materials for new nose cone design.

Senior Engineer & Team Lead – Aerospace Structures, Thermal, and new development of materials•Worked on spacecraft payload responses utilizing ANSYS and PATRAN for 2D and 3D structural analysis model.•Project Manager for several spacecraft electronics payload black boxes - delivered Project management reports for person-hour curves, PERT charts, cost estimations and schedules for design/production hardware.

Team Lead – High Reliability Army/Navy/Avionics•Technical Team Lead for High rel electronics used in Harsh environments for both Army and Navy Projects•Recognized expert in welding, rubber molding, and metal fabrication.•Responsible for document traceability for government deliverables – managed in-house wiring system.