Ting Yan Email & Phone Number
@intel.com
LinkedIn matched
Who is Ting Yan? Overview
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Ting Yan is listed as Global supply chain account manager at Intel Corporation, a with 10 employees, based in Portland, Oregon Metropolitan Area, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Ting Yan.
Ting Yan previously worked as Account Manager at Intel Corporation and Supply chain R&D engineer at Intel Corporation. Ting Yan holds Phd, Physical Chemistry from The University Of Texas At Austin.
Email format at Intel Corporation
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AeroLeads found 1 current-domain work email signal for Ting Yan. Compare company email patterns before reaching out.
About Ting Yan
People deliver results —not machines. This is what I learned in eight years working in high-tech as an engineer. Controversial from a data geek? Maybe. Equipment indeed generates data. AI can analyze the data and even predict the trend. However, people make data a reality. There is a person behind each piece of data. People give data meaning. We lose the human connection when we focus on the data and the data alone. It is in our nature to connect. When people feel connected, they produce, they deliver, they grow. Eighteen months of isolation in the pandemic made the voice in me louder than ever: I want connection! To the people I work with, to the mission, to the data! The ability to connect to people is key to my success. I am intentionally curious and am genuinely authentic while leading a team. I look behind each piece of data, to the person who gives it meaning and ensure she is valued. I empower my team to perform their best because I know I cannot win without help. My genuine desire to connect people and results helps me achieve more, together. My expertise includes semiconductor fabrication, technology road mapping, project management, stakeholder communication, supply chain strategy, and spec and contract negotiation.
Listed skills include Surface Science, Backend Semiconductor Fabrication Processes, Thin Film And Nanoparticle Deposition, Ultra High Vacuum Equipment, and 20 others.
Ting Yan's current company
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Ting Yan work experience
A career timeline built from the work history available for this profile.
Supply Chain R&D Engineer
Advanced Application Engineer
• Developed a defect-reduction roadmap for nanoimprint toolsets compatible with high volume manufacturing. • Managed a portfolio of defect reduction projects to achieve the high-volume manufacturing compatibility goal. Adjusted priorities and resources among projects based on business needs. • Delivered customer demos showcasing nanoimprint’s readiness for high-volume manufacturing on aggressive schedules, despite the pandemic’s disruption.
Senior Application Engineer
• Completed a hardware upgrade project from proof-of-concept to deployment. Led a cross-functional engineering team to identify risks and implement mitigation strategies using a rigorous failure modes and effects analysis (FMEA). • Optimized and implemented a new process that extended defect-free production time by 100%.
Process Engineer
• Developed and implemented a new thin film deposition process that reduced defects by 50% and improved tool uptime, resolving a throughput bottleneck issue for the factory. • Led multi-disciplinary and multi-national engineering teams to solve compounding manufacturability issues across factory sites, leading to a yield gain of two die per wafer. • Reduced tool downtime by 5% by automating monitors and test fires. • Mentored and empowered technicians by identifying individual needs and supporting their professional growth.
Graduate Research Assistant
PhD in Chemistry with a focus on experimental surface science and catalysis.
Teaching Assistant/Lab Instructor
Colleagues at Intel Corporation
Other employees you can reach at intel.com. View company contacts for 10 employees →
Ali Ibrahim, Ph.D.
Colleague at Intel CorporationSan Francisco Bay Area, United States
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Gary Palangian
Colleague at Intel CorporationTempe, Arizona, United States
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PC
Paul Cordeiro
Colleague at Intel CorporationPortland, Oregon Metropolitan Area, United States
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Thom Spengler
Colleague at Intel CorporationSalem, Oregon, United States
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JM
Jose Mario Barboza Jimenez
Colleague at Intel CorporationSan Rafael, Heredia, Costa Rica
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RM
Rui Mo
Colleague at Intel CorporationChina
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MK
Manjunath Kamath
Colleague at Intel CorporationBengaluru, Karnataka, India
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VB
Viktoria Benyaminov
Colleague at Intel CorporationKiryat Gat, South District, Israel
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DA
Dipendra Adhikari
Colleague at Intel CorporationChandler, Arizona, United States
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AB
Ajna Bindu
Colleague at Intel CorporationSanta Clara, California, United States
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Ting Yan education
Phd, Physical Chemistry
B. S., Chemical Physics
Frequently asked questions about Ting Yan
Quick answers generated from the profile data available on this page.
What company does Ting Yan work for?
Ting Yan works for Intel Corporation.
What is Ting Yan's role at Intel Corporation?
Ting Yan is listed as Global supply chain account manager at Intel Corporation.
What is Ting Yan's email address?
AeroLeads has found 1 work email signal at @intel.com for Ting Yan at Intel Corporation.
Where is Ting Yan based?
Ting Yan is based in Portland, Oregon Metropolitan Area, United States while working with Intel Corporation.
What companies has Ting Yan worked for?
Ting Yan has worked for Intel Corporation, Canon Nanotechnologies, and University Of Texas At Austin.
Who are Ting Yan's colleagues at Intel Corporation?
Ting Yan's colleagues at Intel Corporation include Ali Ibrahim, Ph.D., Gary Palangian, Paul Cordeiro, Thom Spengler, and Jose Mario Barboza Jimenez.
How can I contact Ting Yan?
You can use AeroLeads to view verified contact signals for Ting Yan at Intel Corporation, including work email, phone, and LinkedIn data when available.
What schools did Ting Yan attend?
Ting Yan holds Phd, Physical Chemistry from The University Of Texas At Austin.
What skills is Ting Yan known for?
Ting Yan is listed with skills including Surface Science, Backend Semiconductor Fabrication Processes, Thin Film And Nanoparticle Deposition, Ultra High Vacuum Equipment, Gas Chromatography, Aes, Leed, and Data Extraction And Analysis Tools.
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