10+ years of experience in computer-aided design (CAD) and modeling of RF devices and components for microwave and mmWave applications.7+ years of expertise in design and development of custom multi-layer micro-fabrication processes for RF technologies including phase change materials (PCM), MEMS and LTCC. Expert in various engineering simulation tools including 3D CAD, HFSS, CST, ADS, Sonnet, Cadence, and COMSOL.Experienced with RF test and measurement equipment including network analyzers (PNA-X), spectrum analyzers, high-power RF testing, linearity/intermodulation measurements, cryogenic measurements ~3.2 K, on-wafer measurements, and measurements using various electrical engineering equipment.Experienced user of various micro-fabrication equipment including but not limited to deposition of thin films (PVD, PECVD, LPCVD, ALD, and MBE), dry etching (Ion milling, RIE, Si-DRIE, plasma ashing), wet etching, electroplating, lithography (100 kV EBL, 30 kV EBL, maskless aligners), and material characterization (SEM, AFM, TEM, FIB-SEM, XRD, SMM, ellipsometry, and spectroscopy) to name a few.Solid background in micro/nanofabrication, physics, and RF engineering through several graduate-level courses and teaching experiences. Experienced working in a team of researchers on various academic and industrial projects.