15+ years of Manufacturing/Project Engineering and Product Quality Management in high-tech manufacturing. Proven track records of successfully bringing up new products from New Product Introduction (NPI) to sustaining production.Highly skilled working with multinational cross-functional team in manufacturing and effective interface with hardware deign, planning, purchasing, engineering, process, equipment support, manufacturing, and quality.Strong knowledge of PCBA (Printed Circuit Board Assembly), Subassembly, and System-Level Assembly.Optimize and improve manufacturing processes, enhance efficiency, repeatability, cost avoidance, and customer satisfaction.Evaluate new manufacturing technologies, processes, and manufacturing equipment.Analyze root cause, drive corrective and preventive action implementation. Lead failure analysis activities.CORE COMPETENCIESIPC-610 | IPC-7711/21 | J-STD-001 | ISO-9001 | ISO-13485 standards.SMT, Through-Hole, Press-fit Technologies, Box Build/Higher Level Assembly, Fiber Optics, other Cabling and Wiring Harness Assemblies.Six Sigma Methodologies (DMAIC, FMEA., 8D, 5 Whys, Process Capability Cp/Cpk, Pareto Diagram, Flow Chart, Ishikawa Diagram.)Lean manufacturing (Kaizen, Value Stream Mapping, Standardized Work, One Piece Flow/TAKT, Pull System/KANBAN, U-Cell, Poka-Yoke).Manufacturing Process & Equipment Improvement | Continuous Quality Improvement & Control.Cross Functional Team Leadership | Life Cycle Project Management.Manufacturing Procedure Development | Technical Research & Development.DFM, DFA.Stencils, Assembly Tooling/Fixture Designs and Development.Quick-turn NPI, Sustaining Manufacturing.RoHS/WEEE/REACH - EU/China.