T. M. Mak Email and Phone Number
Extensive test and design-for-test experience from a single transistor to billion transistor microprocessors. Experienced and solved IO High-Volume-Manufacturing test issues from Megahertz to tens of Gigahertz. Coached and mentored numerous engineers, researchers, academia and twice received “Outstanding Mentor Awards.” Quickly recognize industrial trends and key test obstacles for product designs. Broad organizational / industrial perspectives leading to identification and formation of alliance / collaboration with key technology players, achieving business goal. Strong team player, good listener (collect inputs / feedback from others to refine). Resilient self-starter that continuously looks for ways / alternatives to achieve goals. Risk taker, willing to take on unfamiliar roles and be flexible on project assignment for organizational needs. Open for any consultant assignment. Specialties: Test, Analog IO test, DFT, 2.5/3D test, program managementPlease contact at tmmak12@gmail.com
Advanced Test Engineering (A.T.E.) Solutions, Inc.
View- Website:
- besttest.com
- Employees:
- 7
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Principal Engineering ConsultantAdvanced Test Engineering (A.T.E.) Solutions, Inc. Apr 2018 - PresentSan JoseTest Methodologies, system design and integration -
Independent ConsultantTm Mak Engineering Nov 2015 - PresentUnion City, Ca
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Test Product Line Manager; Test StrategistGlobalfoundries Aug 2015 - Oct 2015Santa Clara, CaDeveloped test strategies for various foundry products, especially with complex fab/assembly processes, e.g. 2.5/3D. Worked with test development teams to formulate price quotes. Assisted Sales team to explain/communicate to customers about quotes and test requirements. Developed KGD new test business initiative. -
Director, 2.5D/3D Design-For-Test StrategyGlobalfoundries Jun 2013 - Jul 2015Santa Clara, CaDeveloped test strategies for advanced 2.5 / 3D assembly technologies.* Proposed novel test and debug methods for Silicon Interposer, ensuring each were low cost and HVM compatible. Worked with customers and OSAT, implementing suggested strategy. Worked with partners and collaborators on test features in advanced test vehicles. * Defined similar test strategy for 3D die stacking. * Developed cost model, illustrating how more testing actually would save cost on final module; cost ROI… Show more Developed test strategies for advanced 2.5 / 3D assembly technologies.* Proposed novel test and debug methods for Silicon Interposer, ensuring each were low cost and HVM compatible. Worked with customers and OSAT, implementing suggested strategy. Worked with partners and collaborators on test features in advanced test vehicles. * Defined similar test strategy for 3D die stacking. * Developed cost model, illustrating how more testing actually would save cost on final module; cost ROI is 10 to 1.* Filed 3 patents on various packaging innovations. Show less -
Industrial MentorsSemiconductor Research Corporation 1996 - 2015 -
TechnologistIntel Corporation Nov 2010 - Jan 2013Responsible for test technology development, e.g. HSIO test, MEMS self test, RF self test, test for TSV die stacking, embedded DRAM test. -
Engineering ManagerIntel Corporation Feb 2007 - Oct 2010manager responsible for test methodology development -
Industrial Mentor For Marco/Fcrp/Gsrc/C2S2Intel Corporation 2001 - 2007Identified long term industrial challenges. Disseminated trends and visions via numerous presentations at partner schools. Coached research students on their researches. -
Circuit And Layout Dft EngineerIntel Corporation 1995 - 2000Santa ClaraDeveloped AC IO loopback test methodology for Source Synchronous IO and HSIO. Co-chaired corporate level team meeting to drive this into a "Best Known Methodology". Chaired corporate level team meeting to drive cache DFT, e.g. Direct Access Test methodology for large embedded caches.Developed DFT to allow component self test with proper bus cycle hand-shaking.Drove scan layout methodologies to allow efficient DFT layout for custom datapath and layout synthesis.Mentored and… Show more Developed AC IO loopback test methodology for Source Synchronous IO and HSIO. Co-chaired corporate level team meeting to drive this into a "Best Known Methodology". Chaired corporate level team meeting to drive cache DFT, e.g. Direct Access Test methodology for large embedded caches.Developed DFT to allow component self test with proper bus cycle hand-shaking.Drove scan layout methodologies to allow efficient DFT layout for custom datapath and layout synthesis.Mentored and transferred various academic research into internally design and CAD capabilities. Show less -
D2000 Design Methodology Program ManagerIntel Corporation 1994 - 1995drove methodology convergence among different processor design teams. Project received D2000 award later. -
Design Automation ManagerIntel Corporation 1993 - 1994Managed ASIC CAD and computing resources (budget of over a million dollars); Provided CAD tool support for 2 projects (3 chip design teams). -
Product Engineering ManagerIntel Corporation 1985 - 1993responsible for Product Engineering for M286, C286 kit, PC Kit, 80386SX peripheral chip. Recruit/build a PE team to develop manufacturing and silicon debug capabilities for 80386SL and 80486SL. Champion DFT and DFM for this product family. -
Senior Product EngineerIntel Corporation 1984 - 1985responsible for bringing 80286 peripherals to the market. -
Test EngineerElcap Electronics 1980 - 1984Hong Kong And Sf Bay AreaRan test factory; tested bare die on PCB; Set up probe card build and repair operation; Ran the whole supply line from US to wafer fab in HK .
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Product EngineerNational Semiconductor, Hk 1978 - 1979My first test job, on single transistor. I know how to get VI from a curve tracer (and know how to intepret the image). I programmed transistor tester with thumb switches and paper tapes.
T. M. Mak Education Details
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Electronic Engineering -
St. Stephen'S College
Frequently Asked Questions about T. M. Mak
What company does T. M. Mak work for?
T. M. Mak works for Advanced Test Engineering (A.t.e.) Solutions, Inc.
What is T. M. Mak's role at the current company?
T. M. Mak's current role is Principal Engineering Consultant at Advanced Test Engineering (A.T.E.) Solutions, Inc..
What schools did T. M. Mak attend?
T. M. Mak attended The Hong Kong Polytechnic University, St. Stephen's College.
Who are T. M. Mak's colleagues?
T. M. Mak's colleagues are Hector Quimis, Opoku Agyepong, Louis Ungar, Paula Soto Acorido Chanquet.
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