Engineering Representative
CurrentNew Product Development for PLACE-N-BOND products. Design & manufacturing of pre-formed adhesives that are surface mount ready. Applications include: BGA reliability, mechanical bonding, encapsulating, gap filling, strain relief, and flex circuit to rigid connection. Component Value Added ServicesIntegrated Circuit Programming,Component Packaging for Automated Assembly: Surface Mount Taping, Axial and Radial Taping, Tray Packing, Tube Packing, GPAX, Lead WireAssembly, Testing and Packaging Services:Carrier Tapes and Taping Supplies: 8mm to 200 mm embossed Carrier Tape Standard IC TapesCustom Designed Tapes, Reels, Cover Tapes, Moisture Barrier Bags, and ESD Packaging Materials.