Tom Joyner Email & Phone Number

Derry, Pennsylvania

• A Semiconductor Packaging Engineer with over 15 years of experience in manufacturing process development, mechanical package design and subcontract assembly management.
• 16 years custom electronic packaging and tactical dewar design of which 9 years for Infrared Focal Plane Arrays operating at cryogenic through room temperatures.
• 23 years’ experience in assembly process engineering of hermetic and plastic semiconductor assemblies.
• Experience in assembling to MIL-STD 883, MIL-M-38510, MIL-PRF-38534.
• Experience includes Class S, Class K and Commercial hermetic assembly.
• Experience in assembly related failure analysis of semiconductor components.

Teledyne Imaging Sensors

Packaging engineering team lead consisting of 3D designers, drafters and thermal mechanical analyst. Providing program package design to the customer’s physical, environmental and electrical requirements. Using SolidWorks, AutoCAD, Analytical software.Interface between packaging team and other program team members. Providing FPA, C-MOS design engineers.

Provide design engineers and marketing personnel with suitable packaging solutions for current and future products. Perform device/package development duties and provide technical analysis to designers, Quality assurance and production test personnel. Reduction of subcontract cycle time for engineering and product development devices. Technical liaison.

Identify and qualify new subcontract assembly facilities. Reduction of subcontract cycle time by automation and process refinement. Liaison between subcontract assembly facilities, material suppliers and Vitesse. Provide in house technical support regarding assembly related issues. Identify Incoming requirements and inspection criteria of raw material and.

Production process development for new product and optimization of current processes using process capability studies, design of experiments, and statistical process control methods. Process sustaining engineer responsible for both furnace sealing and parallel seam welding, product marking using both offset and pad printing systems, lead trim, solder lead.

Castle AFB California And Fairchild AFB Washington

NCOIC Munitions Maintenance Varification and Checkout Equipment Shop (VACE)