Tom Pinnington

Tom Pinnington Email and Phone Number

Technical Program Manager at Meta @ Meta
Tom Pinnington's Location
Redmond, Washington, United States, United States
Tom Pinnington's Contact Details

Tom Pinnington personal email

About Tom Pinnington

15+ years’ experience in semiconductor process and product development, ranging from start-ups to Fortune-500 companies in the telecom, photovoltaic, and LED lighting industries. In addition to finding materials and process solutions, I have had the opportunity to lead in the transition of novel manufacturing technologies between companies and organizations on the path to commercialization. For example, I authored core IP for a substrate technology enabling scalable gallium nitride device growth and championed the development to commercial viability, while bridging two inter-company transfers. My expertise includes design and optimization of in-house and outsourced multi-step manufacturing processes, compound semiconductor device epitaxy (MBE, MOCVD), wafer bonding, ion implantation, compression molding, thin film dielectrics, CMP, white LED packaging development, LED lighting reliability and performance, and statistical analysis and modeling (SAS-JMP). I have 25 journal publications and 15 issued patents related to semiconductor processes and devices.

Tom Pinnington's Current Company Details
Meta

Meta

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Technical Program Manager at Meta
Tom Pinnington Work Experience Details
  • Meta
    Technical Program Manager
    Meta Aug 2022 - Present
    Menlo Park, Ca, Us
  • Meta
    Technical Program Manager
    Meta Feb 2019 - Aug 2022
    Menlo Park, Ca, Us
    AR/VR Display development
  • Cooledge Lighting Inc.
    Lead Engineer, Led, Optics And Materials Integration
    Cooledge Lighting Inc. Jul 2011 - Sep 2017
    Richmond, British Columbia, Ca
    Recruited to drive and systematize R&D for core technology platform. During the transition to production, I established and ran the LED qualification process while leading materials-related development for new products.• Collaborated with CTO to grow R&D team to 10 members and prove out manufacturing and design concepts, including implementation of a pilot line for a novel white LED design. • Investigated competing processes for integrating phosphors with LED chips at vendor sites in the US, Europe and Asia, and conducted tool acceptance.• Facilitated negotiations among internal and external stakeholders to define LED specifications and supply strategy for an evolving product mix.• Managed optical qualification for the “TILE Exterior” outdoor lighting product (2017 DARC-award winner).
  • Micron Technology
    Principal Engineer
    Micron Technology 2010 - 2011
    Boise, Idaho, Us
    Engaged with the Micron NPI team to transfer a new substrate technology for epitaxial growth of gallium nitride LEDs on silicon, into an 8-inch silicon fab. • Guided DOE planning and analysis for multiple process optimizations (ion implantation, PECVD/LPCVD dielectrics deposition, CMP, wafer bonding).• Created and transmitted process and modeling documentation resulting in successful technology hand-off. • Prepared a technical assessment of engineered substrate product opportunities and presented to executive leadership
  • Amberwave Systems Corporation
    Senior Member Of Technical Staff
    Amberwave Systems Corporation 2008 - 2010
    Us
    Amberwave Systems acquired the engineered substrate product from Aonex Technologies, and I led the technology transfer and drove process innovation in the push to commercialization. Two years later, the technology was acquired by Micron Technology.• Managed acceptance of critical process tooling ($1M) on schedule, including vendor selection, tool design optimization, and testing at vendor sites in the US and Europe.• Guided team in scaling from 2-inch to 4- and 6-inch wafer diameters over an eight-month period. • Generated and validated physical models for performance of thermally mismatched substrates, enabling quantitative assessment of product opportunities and processing strategies.• Increased throughput by a factor of 10 while concurrently doubling yield through process optimization and redesign.
  • Aonex Technologies
    Vice President Of Engineering
    Aonex Technologies 2007 - 2008
    Prepared presentation materials and accompanied the President in marketing the company technology to prospective acquirers including a conference presentation (ICNS-7). During this transition period I took on ownership of the full manufacturing process (ceramic wafering, dielectrics deposition and CMP, donor substrate reclaim, ion implantation, wafer bonding and layer transfer) ensuring a reliable supply of prototypes and continued process refinements.
  • Aonex Technologies
    Senior Process Engineer
    Aonex Technologies 2004 - 2007
    As a technical principal at a series-A start-up, I spearheaded new process development and created product ideas that leveraged the company expertise in wafer-bonded laminate substrates. • Built vendor relationships to establish an outsourced fabrication line for novel refractory metal and poly-crystalline ceramic substrates.• Authored core IP for engineered substrates for gallium nitride (GaN) growth.• Collaborated with Sandia National Labs to deliver first-ever GaN LED growth by metalorganic chemical vapour deposition (MOCVD) on a wafer-bonded substrate.
  • Ortel, A Division Of Emcore
    Senior Scientist, Mocvd
    Ortel, A Division Of Emcore 2002 - 2004
    Alhambra, Ca, Us
    As the lead for support of device R&D, I operated and maintained a dual growth-chamber multi-wafer MOCVD tool (Veeco D180) for a total of more than 3000 deposition runs. • Increased wafer throughput by a factor of 3 and improved run-to-run wavelength uniformity by a factor of 2, by exploiting in-situ optical monitoring to streamline process calibration.• Developed InAlGaAs multi-quantum-well grating over-growth process for 10GB uncooled DFB lasers. • Designed a strain-compensated tunnel junction enabling operation of first VCSEL at Ortel.
  • Lucent Technologies / Agere Systems (Now Broadcom)
    Member Of Technical Staff, Mocvd
    Lucent Technologies / Agere Systems (Now Broadcom) 2000 - 2002
    Within the manufacturing MOCVD team, I interfaced with R&D (Bell Labs) to bring new capabilities online for the InGaAsP/InP-based telecom laser products. I was also the process owner for tunable-DBR laser production.
  • Simon Fraser University
    Post Doctoral Fellow
    Simon Fraser University Jan 2000 - Jun 2000
    Burnaby, Bc, Ca
    MOCVD of arsenic-based semiconductors. Developed an alkyl concentration monitor for metalorganic precursors based on single-wavelength infra-red absorption.

Tom Pinnington Skills

Semiconductors Research And Development Thin Films Materials Materials Science Characterization Design Of Experiments Engineering Manufacturing Mocvd

Tom Pinnington Education Details

  • The University Of British Columbia
    The University Of British Columbia
    Physics
  • University Of Alberta
    University Of Alberta
    Engineering Physics

Frequently Asked Questions about Tom Pinnington

What company does Tom Pinnington work for?

Tom Pinnington works for Meta

What is Tom Pinnington's role at the current company?

Tom Pinnington's current role is Technical Program Manager at Meta.

What is Tom Pinnington's email address?

Tom Pinnington's email address is tp****@****ail.com

What schools did Tom Pinnington attend?

Tom Pinnington attended The University Of British Columbia, University Of Alberta.

What skills is Tom Pinnington known for?

Tom Pinnington has skills like Semiconductors, Research And Development, Thin Films, Materials, Materials Science, Characterization, Design Of Experiments, Engineering, Manufacturing, Mocvd.

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