Responsible for Product Integrity for NPI Ring HW core devices• Responsible to execute the entire Product Development Process (PDP) focusing on HW Safety, Quality, Compliance, Manufacturability, and Reliability.• Responsible for the scoping stage with Product Requirements Documentation (PRD), contributor/approver Product Design (PD) and plans for Risk Management and all product requirements are defined. • Product technical requirements to assure the all CTQs (Critical-to-Quality / Integrity), are verified during design, and all critical functional requirements are tested and/or verified. Oversee and ensure the product quality, and reliability, compliance and safety of devices.• Responsible for piloting and deploying Artificial Intelligence through in-situ quality monitoring.• Mentor the organization on appropriate documentation, problem solving methodologies, root cause analysis, and presentation of data. • In charge of escalation of risks and blockers to the leadership team by providing the needed data to make a data driven decision.• Develop product integrity three- and five-year plans and communicate it with the leadership team.• • Facilitating the Return Rate Reduction initiative as part of a large cross-functional team to mitigate design risks and reduce the failures in the field, during and after New Product Introduction (NPI) phase.

• Creating new innovative and differentiated diagnostics products and successfully launching into high volume production laboratories in the US and UK. • In charge of equipment installation and qualification in multiple labs and developing the work flow and work instructions.• Established and facilitated a Global Joint Engineering Team for world wide lab network: responsible for continuous improvement projects and standardization across the WW lab network.• Provide mentorship and professional development of the engineering team and supporting technical staff through direct interaction and training.• Led the lessons learned efforts to identify gaps and develop design and process improvement criteria from process transfers.• Development and implementation of governing global Standard Operating Procedures to meet the regulatory requirements and identify process quality controls.

• Responsible leading a team of test, manufacturing and OEM engineering to introduce new products from development to production.• Developed and implemented new technologies to enhance production quality, capacity and efficiency.• Launched multiple health and wellness devices from design to production launch (e.g., Echo Frames). Drove program schedule, technical issue identification, root cause resolution and ramped contract manufacture while achieved at or above yield targets.

Responsible for driving contract manufacture preparation for proto type builds, production process development, documentation, optimization and validation.• Developed and implemented new technologies to enhance production quality, capacity and efficiency.• Successfully launched iPad Pro, Smart Keyboards, and Apple Pencil for multiple geographies worldwide.

Leadership Sponsor: Successfully established first corp orate model to the board.Member of development team to provide mentorship and character building education to Austin-area children for a full year. The First Tee of Greater Austin has served approximately 4,000 children in the Austin community.

Engineering Manager: Equipment Innovation 8/12-6/13Responsible for overall site Equipment Management Program implementation. Led multiple cross departmental teams to implement programs, projects, best known methods and standardization.Engineering Manager: (CVD, Metals) 4/07-8/12Manage a process and equipment engineering department consisting of up to >100 engineers and engineering technicians for 200mm DRAM and 300mm Flash Memory (across two geographical locations) and System LSI Lines. Responsibilities included installation, qualification (including technology transfers) and ramp of the 300mm facility and subsequent process improvements, tool availability, cost, and yield improvements.

Engineering Manager: (Photolithography, Etch, Thin Films, Planar) 9/00-4/07Managed a process engineering group consisting of 20 engineers and four engineering technicians. Responsibilities included process improvements, tool availability, and yield improvements.Sr. Process/Equipment Engineer: Thin Films 6/96-9/00Led team for Adhesion and Sputter Groups. Supervised 10 engineers and three Senior Equipment technicians. Yield Engineer (Fab12) 5/94-6/96 Responsible for the Fab environmental sustaining engineering functions.