Trent Thompson Email & Phone Number

Tempe, Arizona, Us

Santa Clara, California, Us

Austin, Tx, Us

Built a global Packaging team of over 20 engineers responsible for Technology Development, Design & Modeling, New Product Introduction, Yield Enhancement, and Sustaining Activities. Drove best practices across 11 OSAT factories shipping advanced package technologies to top tier mobile audio customers at very high volumes. Managed $6M annual budget enabling key product wins and supply chain readiness that doubled company revenue.• Technology Development: Led weekly and QTRs with major customers and OSATs to introduce the industry’s most advanced mixed-signal WLCSPs. Created certification process for new technologies. Established cross-functional teams to design and test advanced packaging test vehicles, verifying package and die interaction rules across fab technology nodes. Proactively addressed customer interests in electro-migration, die cracking, high voltage, and thermal performance. Drove development of thicker dielectric and metal stack for WLCSP processing to address customer systems interaction issues. • Design & Modeling: Creation of a design and modeling team including the oversight of a database and automated request system, publication of design rules and best-known methods, and vetted thermal analysis techniques. • NPI: Improved qual and on-going reliability monitor process by developing PCB carrier process (reduced cost by 80% and qual cycle time; increased 1st time pass qual rate). Achieved 40% package cost reduction over 3 years by developing and qualifying additional WLCSP OSATs and enabling Cu wire on NPIs. Oversaw process development across all OSATs. Developed new ball alloy to improve BLR performance by 50%.• Yield Enhancement & Sustaining: Ramped WLCSP in HVM with yields over 99.9% and record low customer returns. Yield savings on HV product while also satisfying the industry’s most stringent quality criteria. Dramatically reduced PPM levels on returns. Negotiated standardized WLCSP process BKMs across 5 OSATs with no additional cost.

Austin, Texas, Us

Microcontroller Products, Program Manager & Distinguished Member of the Technical Staff (2007–2010; 2011–2013)Led a small team responsible for the strategy and execution of manufacturing capacity assurance, cost reduction, and change management. Negotiated with automotive customers on implementation plans to support the business.• Expedited automotive customer acceptance of copper wire by driving technology team to create a manufacturing process window and pad designs for each fab node meeting specific customer requirements. Executed the plan one year ahead of time, saving the company $20-40M/year starting in ’14.• Streamlined change management process resulting in cost savings of $60M.• Created package portfolio consolidation strategy resulting in package cost reduction of $6.8M annually. • Led Bosch Package Improvement cross-functional team, focusing on the change management process and reducing customer returns, and improving our supplier ranking from #24 to #2 within two years.

Austin, Texas, Us

Managed global team responsible for $250M annual spend across 62 suppliers, driving 5% cost savings year on year.• Led the corporate Japan earthquake recovery effort successfully working with product teams and 2nd and 3rd tier suppliers to assure packaging material supplies and maintaining all product delivery commitments.• Introduced new suppliers for high risk / cost materials resulting in a 50% decrease in packaging cost and successful production ramps for key customers.• Negotiated acceptance of 2nd source substrate supplier for Networking products saving $5M/year.• Drove company wide effort to improve quality excursions at material suppliers. Reduced Supplier Quality Incidences by 50% in 2010.

Chicago, Illinois, Us

Global Package Engineer (1991 – 2004) / Engineering Manager (2004 – 2007)Held various Package Engineering roles from an engineer to leading 130- employees across 7 locations worldwide. Responsibilities focused on New Product Introduction, ramping new processes and technologies into high volume production in 26 factories worldwide supporting wireless, networking and automotive products. A few examples include:• Led cross-functional effort to reduce cost through adoption of new technologies across internal and external manufacturing, realizing $14M cost savings in 2006• Increased assembly yields on new technologies into manufacturing by implementing six sigma methodologies; for example, improvements of 10% for Power packages and 3% on flip chip BGA. • Revamped NPI/NTI process to bridge gaps and streamline activities from technology development to production ramp. For example, advancements in RF Modules with passives and stacked die ramped into HVM at benchmark yield, 98%+; resulting in $100M in revenue for corporation and successful launches of Motorola handsets.• Led technology development projects for cost reduction, including; qualification of the Molded Array BGA package; decreasing package cost by 20% and ramping to 12M/units per week in two factories; Lead frame package design and assembly process optimization to eliminate the need for bake and dry pack resulting in a $55M cost savings and cycle time reduction of 15-20%; and Introducing advanced mold compounds, eliminating the need for polyimide and saving $30M.

Responsible for facilities equipment in Ship Shoal Region in the Gulf of Mexico that consisted of 6 production platforms.Coordinated facilities projects requiring hiring crews to execute on installations of various manufacturing equipment including pumps, contractors, and pipelines to support oil and gas production.Installed equipment that resulted in 20-30% increase in production.

Master Of Science, Manufacturing Systems Engineering

Bachelor Of Science, Mechanical Engineering