Job Duties Responsibilities• Responsible to review the process flow chart, work instruction, production jig fixtures and guidelines for new model or due to ECN update, ensure customer's product requirements are meet.• Responsible for pre-production run and ensure process, work instruction, production jigs/fixtures, materials, and finished product comply with customer's requirements.• Evaluate processes, production methods, production jigs / fixtures, production equipment/machine and implement improvement to enhance productivity and quality environmental.• Evaluate materials and qualify alternate source for cost cutting purpose.• Lead Process engineering team and responsible to review the performance evaluation of subordinates.• Lead Test engineering team and responsible to review the performance evaluation of subordinates.• Support & comply fixture fabrication request from other department / section.• Authorize to stop production for further investigation if any problems on materials, process, production jigs/fixtures, equipment or machineries.• Lead Engineering Team to support production line with continues improvement, implementation POKAYOKE system to avoid defect and improve yield in the production line.• Meeting with costumer for any Project transfer that possible to be transfer to SEK Karawang than help coordinate with all team to build new line with high capability to make good product with the best quality result and meet costumer specification.

All Engineering Activity exspecially for new project development

Job Duties Responsibilities· Maintaining Quality Performance of PCBA Process SMT and 2nd Assembly process.· Deploying project such as Rohs Compliance implementation, ECN implementation,Pilot run for new prototype model PCBA, Product transfer and Product adaptation.· Strong Root Caused analysis for quality issue, design issue, process issue.· Setup New Process for model transfer and new model.· Controlling , verification and analysis of daily reject and quality issue· Optimizing process SMT and 2nd Assembly process performance.· Design JIG for SMT and wave solder process include assembly process.· Create procedure such as working instruction for all process PCBA ( SMT, 2ndassembly Process)· Create Training Procedure and monitoring implementation at PCBA line.Create estimation process ( take time, bench usage, operator needed) production fornew model pcba.· Maintain all process PCBA is in a good line , meet the target output and high qualityproduct.· Upgrade and improve all line process to find good balancing between working hour,operator usage and output production base on LEAN, Ergonomic and SPS rules.· Create Procedure for Reflow and Wave Solder temperature measurement.· Create qualification report for new machine and new process production.· Create Capacity File, Man Hour Calculation and project costing.

Job Duties Responsibilities· Control production line to ensure all process has run properly.· Investigate NG Product and prepare investigation report.· Continues improvement to achieve better productivity.· Maintain good housekeeping practice/habits and applies 5s principles consistentlywhen carrying out daily activities.· Prepare production defect report based on defective record summary and causinganalyze, and follow up to superior ( monthly).· Report action to solved problem at production to superior ( monthly)· Train manpower about production process.· Support arrange production process at sub cont· Prepare for Pre-Production ( document, material, equipment and drawingcompleteness).· Prepare Engineering Information ( EI)· Investigate a problem if any costumer complain and abnormality process production· Prepare new equipment and machine in production line.· Create report job target to superior.· Trouble shooting and responsible for PCBA process such as subjects1. Soldering FPC.2. PCBA Floppy Disk Drive.3. Made innovation in production process.4. FCT (Function Circuit Test) for PCBA FDD.5. Cable checker for FPC and Adapter CDRW/ DVRW model.6. Plan and conduct meeting Pre Production (EI/ECN Application).7. Wave solder and point solder for soldering component PCBA FDD.8. SMT (Surface Mounting Technology) especially for reflow process.9. Welding process using NA66-TCW 215 for high temperature soldering.10. Analyze and evaluate QA failures and costumer returns and implementsolution to test related problem.ISO Quality Training1. ISO 9001 Awareness2. Basic SHE Awareness3. Introduction ISO14001:19964. Introduction ISO 18001 : 19995. Hazard Identification & risk Assessment6. Environment Aspect Impact Assessment7. Accident Investigation8. Waste Management.