Trish Smith, Ph.D. Email & Phone Number

Dallas-Fort Worth Metroplex

Thin film deposition and plasma etch processing. Consulting for process solutions for thin film plasma etch and deposition as well as resist strip. Expert in process recipe creation, improvement or development, qualification procedures and documentation of plasma deposition or etch processes for Si, GaN, GaAs and HgCdTe device applications. Full time, part.

Dallas/Fort Worth Area

2000-2015: Elected to eight two-year terms as Secretary, Dallas-Fort Worth Section of the American Chemical Society.2019-2023; 1992-1997: Awards Committee member, Dallas-Fort Worth Section of American Chemical Society; 1996, 2021 Awards Committee Chairman

Dallas/Fort Worth Area

Addison, Texas

Senior Process Engineer in MEMS semiconductor processing facility. Created new and developed or improved existing processes using DOE (JMP) methodology for MEMS devices based on Si substrates. Processes include dielectric film etch (LAM 4500 oxide, nitride, SiON), DRIE Bosch process for deep Si etch (STS DRIE etch tool), PECVD SiO2, SiN, SiON (STS PECVD.

Richardson, Texas

• Plasma process development for GaN, GaAs and Si based devices.
• Plasma Process Engineer, (2016-2017 ) Metal Etch, BAW Pilot Line (startup), Farmers Branch, TX; Etch AlCu, W, TiW, SiO2, SiN for BAW devices on startup pilot line; sustain production processes.
• New Technology Integration, GaN Via etch, Plasma Process Engineer (2011-2016 ) Developed and released to production Trade Secret (author) etch process for vias through 100 um SiC/GaN backside process. Process enabled.
• Experienced in thin film metrology including Thermawave, ANK, Ellipsometry, AFM, SEM, and XPS, Auger ES, D-SIMS and TOFSIMS.

• Injection molded and compression molded precision optical components from various plastic materials. Antireflective coatings in the visible to near-IR wavelength range. Diamond-turned optical mirrors.
• Created optical coating department for deposition of antireflection and high reflectivity coatings on optical plastics such as acrylic, polycarbonate and cyclic olefin polymers, as well as Al diamond machined mirrors..
• Trained technician to operate and maintain coating and characterization equipment. Developed standard operating and maintenance procedures for coating and characterization equipment.

• Patents: 35 US and Foreign; most of these received one or more TI Patent Awards for their continued use in production fabs worldwide.
• Elected Distinguished Member of the Technical Staff (less than 2% of staff); 2001, Silicon Technology Development
• Elected Senior Member of the Technical Staff; 1998, Silicon Technology Development
• Plasma Etch, Kilby and DMOS6 Fabs; 1998-2007, CMOS1. Developed trench etch and developed and patented in situ cleans for low k materials.
• Surface Preparation Group, Kilby Fab; 1998-2007, CMOS1. Invented, developed and implemented into Cu production fabs plasma cleans and resist removal processes compatible with low k dielectric materials and Cu. Invented.
• Plasma Etch Branch, Semiconductor Process and Device Center, Process Design and Control; 1995-1998. Developed dry plasma clean processes for post contact and post via etch applications. Invented oxygen-free photoresist.

Phd, Chemistry

B.S., Chemistry

Activities and Societies: Phi Beta Kappa, Sigma Xi Honor Societies

Education record