Thomas Wilhelm Email & Phone Number

Minneapolis, Mn, Us

Minneapolis, Mn, Us

Fremont, Ca, Us

Cork, Ie

Cork, Ie

• Si and III-V process development for heterogeneous component integration• Project management, and liaise with clients through to project completion• Drive innovative transfer printing technologies for photonics, optoelectronics, and photovoltaics

Cork, Ie

• Realize heterogeneous integration of photonic integrated circuits (PIC)• Establish two-sided processes onto rigid and flexible substrates, and photonic circuit boards (PCB)• Expand conventional release etchants, and define dielectric and photoresist tethering systems• Contribute to device modelling, team meetings and reports, and overall project direction• Project and budget management, student and research supervision, and proposal writing• LED, microLED, LD, VCSEL, III-V photovoltaics, and photonic power transfer (“power beaming”)

Rochester, Ny, Us

My doctoral research focused on innovating new semiconductor processing techniques that overcome processing limitations inherent to conventional approaches. This included the development of wet-etch processes for three previously unexplored III-V material systems (i.e., GaSb, InGaP, and AlGaAs). These techniques are called "metal-assisted chemical etching" (MacEtch or MACE). My metal-assisted chemical etching experience includes Si, GaN, and various III-V materials, including GaAs, GaSb, InAs, InP, AlGaAs, and InGaP.Experienced with the following fabrication tools and processes:Photolithography: steppers and contact aligners, reticle design and fabrication.Physical vapor deposition (PVD): thermal and e-beam evaporation, and sputtering.Chemical vapor deposition (CVD): atomic later deposition (ALD).ElectrodepositionWet etching: metal-assisted chemical etching (MacEtch or MACE), RCA clean, Piranha etch, KOH, HF, etc.Dry etching: reactive-ion etching (RIE), inductively coupled plasma (ICP), plasma ashers.Annealing: rapid thermal annealing (RTA)Experienced with the following characterization tools and processes:Scanning electron microscopy (SEM)Transmission electron microscopy (TEM)Energy dispersive X-ray spectroscopy (EDXS)Atomic force microscopy (AFM)X-ray diffraction (XRD)Photoluminescence (PL)Spectrophotometry (UV-Vis-NIR)Raman spectroscopy (RS)Ellipsometry (VASE)Interferometry

Golden, Co, Us

Awarded the 2017 NREL Graduate Research Internship in the fellowship's inaugural year.This work was part of the DOE SuNLaMP initiative "Enabling High Concentration Photovoltaics with 50% Efficient Solar Cells."My contribution focused on process development and device optimization. Process development included the creation of wet- and dry-etch processes for 5- and 6-junction photovoltaic mesa etching (i.e., device isolation) towards promoting smoother device sidewalls. Device optimization focused on minimizing parasitic resistance losses via deposition of thick contacts to lower contact resistance, and reduce perimeter recombination by limiting sidewall and surface roughness.

Ontario, New York, Us

• Identify areas for testing, measurement, and data analysis improvement• Preparation and oversight of test plans/reports for non-standard and high-value jobs• Creation of standard work and training documents for new metrology test equipment• Perform statistical and failure-mode analyses (FMEA), and root cause/corrective actions • Actively contribute to continuous improvement and metrology training to drive innovation• Flexibility to assist both Manufacturing and Quality departments as needed• Interact and liaise with external customers, suppliers, and vendors

Doctor Of Philosophy - Phd, Microsystems Engineering

Master Of Engineering - Meng, Mechanical Engineering

Bachelor Of Science - Bs, Physics