Ty Wang Email & Phone Number

Taiwan

Responsibilities: project management, process development and integration Led and coordinated the fab/bumping/assembly/testing team for 3DIC projects. Managed deliverables, schedules, and weekly conferences with customers. Tracked projects progress daily for prompt issue analysis and problem solving. Assisted customers’ design to enhance product manufacturability and yield. Developed the 3DIC test vehicle process for top FPGA/GPU chip makers.Achievements:  Shipped the 1st 3D package with GPU/DRAM for GPU chip makers. Delivered the 1st 3D interposer package with embedded passive device. Enabled the prototype of the 1st N20 FPGA with 3D package (2011 production). Enhanced process yield within 2 months from 40% loss to target >95%.

Responsibilities: process simulation modeling and integration Established thermal-mechanical model for package yield, reliability, and cycle time enhancement. Achievements: Improved the N45 flip-chip package yield with 15~20% thermal stress reduction.

Responsibilities：Big data analysis, process control Developed tool diagnostic system for fab real-time optimal tool dispatching. Co-developed (with UC Berkeley) the VM (virtual metrology) methodology.Achievements: Improved N65 WAT (wafer acceptance test) 10% with tool diagnostic system. Enhanced wafer throughput by replacing the metrology with VM model.

Master Of Science (M.S.), Mechanical Engineering

Activities and Societies: stanford taiwan student club

Bachelor Of Science (Bs), Bio-Industrial Mechatronics Engineering

Activities and Societies: piano club, skating club, manger of basketball team