Roles & Responsibility:• New product Implementation and validation of SMT new line setup & MI, NOKIA mobile phones.• Reviews the Placement layouts with layout and design team for DFM.• Review the preliminary versions of BOM for component and manufacturability identifies technologies required for new products, evaluates and qualifies the products. Publishes DFM reports to track and close the DFM issues.• Driving the Manufacturing facilities test cell setup and line layout.• Improve FPY (Final pass yield), Reduce RTR(Retest rate) and RMA (return merchandise authorization) Synchronizing with SMT, kitting and Assembly, quality, testing team & ODM for smooth ramp up and sort out issues.• Conducting line balancing and time studies for various process steps.• Defining and procuring production test cell and product handling equipment. Defining new product test steps to assure efficiency in mass Production.

Job Responsibilities:• Lead of Diagnostic team responsible to analyze 3G, LTE, PCBA board RF mixed level issues like (power issues, power amplifier, LNA, Receiving, Transmitting and digital sections).• Testing the board in Automated Test Equipment (ATE) like ICT (In circuit test), MFT and FCT.• PCBA boards debugging using OR-CAD, Schematics and layout’s.• Hands on experience in Lab equipment’s like Multi meter, Spectrum Analyzer, Network analyzer, Vector Signal Generator, Digital Oscilloscope.• Knowledge on smith chart using finds VSWR, impedance matching, reflection coefficient.• Preparation detailed Failure analysis report for problem control to minimize failures.• Taking Preventive Action by finding the root cause of a problem with the help of (7QC, 5why, 8D).• Supporting with production team to improve First Pass Yield (FPY) and reduce SCRAP and WIP.• Coordination with other supporting team like Process, Product, Quality, Material etc..,• Given feedback and getting feedback from RD, CFT for sort out the product issues and Process issues.• Given Training classes analyzing and rework method for new joining operators and technicians.• As per IPC standard doing rework the board like Soldering and De-soldering Chip components.• Maintain and follow the safety measures and 5S, ESD requirement in the working areas.

Job Responsibilities:• Troubleshooting the Testing failed boards from Boundary scan station, Function test station & screening station, (Transmitting, Receiving (TRX), Power amplifier (PA), digital processing unit (DPU)).• Debugging tools for PCB, Like Multi meter, LCR Meter, Tone ohm meter, Spectrum Analyzer, signal generator and CRO-Oscilloscope.(Agilent, Rohde & Schwarz, Anritsu, Tektronix, Hewlett- Packard ,Fluke)• Responsible for WIP, TAT, output tracking the hourly, Shift wise, daily & weekly production.• Define the flow charts and WI for products and ensure the compliance for customer satisfaction.• Planning for the Tools and jigs fabrications related to the Project depends project requirement• Implementation in day today activities are like (Kaizen, Poka -Yoke,)• Following the process in company ( 5S, VMS, PDCA,TPM )• Problem solving with the help of (7QC, 5why, 8D, lean projects) tools.

Nature of Work in Tata sky repair centre:• Testing the tata sky set up box boards.• Trouble shooting the boards of tata sky dish boxes.• Planning for production

Nature of Work in R-Logic India Pvt Ltd:• Level-1Repair :- FPD and LCD display, like IIS , Dismantling and Assembling of monitors, AD board and Inverter board replacement, FW and EDID updating, ECN implementing ,trouble shooting the defects, job tag maintenance, team maintaining, planning for the production (repair), report maintaining ,being as a responsible person for any queries and issues in the team etc.• Worked for Monitors like Dell, Cmo, Sony and HP.Customer field issues solving.• Level-3 repair:- In clean room environment like,1 Laminating the CF and TFT polarizer’s. 2 BLU replacing and BLU Repair like CCFL.3 De-bonding and bonding IC’s in MX-110 machine