Upendra Balehithlu
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Upendra Balehithlu Email & Phone Number

Senior Staff Engineer, Packaging Design R&D, BE DEV at Infineon Technologies
Location: Singapore, Singapore, Singapore 11 work roles 2 schools
1 work email found @infineon.com LinkedIn matched
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Current company
Role
Senior Staff Engineer, Packaging Design R&D, BE DEV
Location
Singapore, Singapore, Singapore
Company size

Who is Upendra Balehithlu? Overview

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Quick answer

Upendra Balehithlu is listed as Senior Staff Engineer, Packaging Design R&D, BE DEV at Infineon Technologies, a company with 19449 employees, based in Singapore, Singapore, Singapore. AeroLeads shows a work email signal at infineon.com and a matched LinkedIn profile for Upendra Balehithlu.

Upendra Balehithlu previously worked as Senior Staff Design Engineer at Infineon Technologies and Staff Engineer at Infineon Technologies. Upendra Balehithlu holds Bachelor'S Degree, Innovation & Product Design from University Of South Australia.

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{first}.{last}@infineon.com
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Profile bio

About Upendra Balehithlu

Experienced Mechanical Design professional with the past 25 years of experience in the Semi conductor industry Like National Semi conductor , Stats Chippac & Infineon Technologies. Prior to that 5 years of Design working experience in various Precision watch components design as well as worked in KSB which is one of the worlds' leading manufacturers of pumps, valves and related systems .In the past 10years patented 5 of the Semiconductor concepts while working on various New Design concepts of Semiconductor packages and Lead Frame for Automotive & Industrial applications . Highly motivated engineer who contributes to the success of the projects with fast and proactive solutions. Have worked with many LF supplier (sourcing) and qualified Japanese , Korean, Taiwanese and other Leadframe and Copper Clip manufacturers to make sure Backend Development gets the Best material with the fastest Lead time.Have worked on various projects to reduce cost, better Technology and Material selection (design for manufacturing) to meet road map requirements. Closely working with LF suppliers to resolve technology/quality issues and responsible for improvement programs.Specialties: Semiconductor package design, GD&T, Tolerance & fit analysis , 3D modelling, Inventor, Solid works, Auto cad, Rapid prototyping, and EOL tool manufacturing, CNC, Various internal design tool -Deal, k layout, Co design etc . Various tool making , Stamping , Etching , CNC milling EDM Patents1) semiconductor Device Including an Encapsulation material defining notches.

Current workplace

Upendra Balehithlu's current company

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Infineon Technologies
Infineon Technologies
Senior Staff Engineer, Packaging Design R&D, BE DEV
germany
Website
Employees
19449
AeroLeads page
11 roles · 28 years

Upendra Balehithlu work experience

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Senior Staff Design Engineer

Current

Singapore

Currently working in R&D for Design of Semiconductor packages and lead frame, enabling Backend tooling, Technology development.Promoting Invention Disclosure submission, actively engaged in Innovation/Development topics via

Apr 2022 - Present

Senior Engineer I

Singapore

New Package design, lead frame concept and implementation, Design of package concepts and Design of Molded strip and singulated units.Responsible for Sourcing of LF suppliers and qualification for R&D projects DFM, Technology and Material selection (design for manufacturing) to meet road map requirementsWorking on various cost reduction programs like.

Jan 2017 - Aug 2020

Senir Engineer Ii

Singapore

New Lead Frame Concept design and implementation Design of Package Concept & Design of Molded Strip meant for EOL tools manufacturingInvolvement with R&D project team in terms of Package Design and LF supplier sourcing and QualificationDFM, Technology and material selection to meet road map requirements Provide support in cost reduction programs, alternate.

Jan 2014 - Dec 2016

Engineer I

Singapore

Responsible for LF design of Logic and Power Packages - Worked on the 3D modelling for the new concepts for Power packages.

Jul 2007 - Dec 2013

Engineer Ii

Singapore

Responsible for LF design of Logic & Power packages - Worked on 3d modelling for the new concepts for Power packages

Jul 2003 - Jun 2007

Assistant Engineer

Singapore

Responsible for LF & Package design support for Logic & Power packages design/Prototyping /Conceptual design

Jun 2000 - Jul 2003

Associate Engineer

During 18 months of tenure worked with TEST engineering and Test maintenance Working closely with the team of maintenance engineers to make sure all TEST handlers are well maintained and Preventive maintenance are executed as per schedule.Worked for Wafer test engineering whereby executing preventive maintenance of Tell Test probers.Also set up of Wafer.

1998 - 2000 ~2 yrs

Engineering Assisitant

During 18 months of tenure worked with the Assembly department which is meant to handle encapsulation. Doing package convertions for DEV support example MCP to BGA, Keeping mold calibrated, checking the mold temparatures to make sure it is @ 180Doing periodic Preventice maintence, replacing spare parts as per due dates or to replace Hydraulic oil which.

Jan 1996 - Apr 1997

Supervisor -Cad

Ksb Pumps Company Limited

During my tenure for less than 2 years, I enjoyed working with R&D engineers on various Submercible Motor and pump designs.I had the opportunity to thoroughly understand and work with various PROJECTS in the engineering team for Product development of Submersible pumps/motorsI was given opportunity to work on CAD to come out with the complicated cast iron.

Apr 1994 - Jan 1996

Assistant Engineer

Growel Times/Falken Watches Ltd

During this 5 years ( infact 2 differnt watch companies) I was expected to design various watch components, Bezel, Bezel ring, Back cover etc Tho job involved Designing of such components and also to make sure it can be manufactured using the existing Stamping and machining tools In the year 1992 i was trained to use CAD Tool and create programming for CNC.

Mar 1990 - Apr 1994
Team & coworkers

Colleagues at Infineon Technologies

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2 education records

Upendra Balehithlu education

Diploma, Mechanical Engineering

Karnatak ( Govt.) Polytechnic, Chikmagalore
FAQ

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What company does Upendra Balehithlu work for?

Upendra Balehithlu works for Infineon Technologies.

What is Upendra Balehithlu's role at Infineon Technologies?

Upendra Balehithlu is listed as Senior Staff Engineer, Packaging Design R&D, BE DEV at Infineon Technologies.

What is Upendra Balehithlu's email address?

AeroLeads has found 1 work email signal at @infineon.com for Upendra Balehithlu at Infineon Technologies.

Where is Upendra Balehithlu based?

Upendra Balehithlu is based in Singapore, Singapore, Singapore while working with Infineon Technologies.

What companies has Upendra Balehithlu worked for?

Upendra Balehithlu has worked for Infineon Technologies, Stats Chippac, National Semiconductor, Ksb Pumps Company Limited, and Growel Times/Falken Watches Ltd.

Who are Upendra Balehithlu's colleagues at Infineon Technologies?

Upendra Balehithlu's colleagues at Infineon Technologies include Rith Phal, Sven Schwarzer, Lena Röser, Yu-Wen Huang, and Leo Mathews George.

How can I contact Upendra Balehithlu?

You can use AeroLeads to view verified contact signals for Upendra Balehithlu at Infineon Technologies, including work email, phone, and LinkedIn data when available.

What schools did Upendra Balehithlu attend?

Upendra Balehithlu holds Bachelor'S Degree, Innovation & Product Design from University Of South Australia.

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