Testing, Schematic Development, Component FootprintsCreation, PCB Layout Design, and Thermal analysis, FabDrawing Created.

Circuit Design, Testing, Simulation, SchematicDevelopment, Component Footprints Creation, PCB LayoutDesign, and Thermal analysis, Board Bring up (Hardwareand Firmware) PCB Fab and Assembly Process.

High speed digital PCB design.•High Density Interconnect PCB design using Blind and buried via•Mixed signal (Digital, Analog & RF) PCB design.•PCB Designing of Minimum of 2 Layers and Maximum of 14 Layers.•Designed PCBs with a minimum trace width of 3.7mils/3.7mils Spacing.•Designed PCBs with 0.8mm pitch BGA.•Designed PCBs with RF signals of about 2.4GHZ frequency.PERIPHERAL DEVICES KNOWLEDGE: DDR, DDR2, DDR3, NAND, NOR MEMORIES, LCD, AUDIO CODEC, WIFI/BT MODULE, RS232 DRIVER, ADC & DAC, LINEAR,SWITCHING REGULATORS AND PMICCORE SKILLS:•Strong experience in Schematic Symbol creation and PCB Footprint creation.•Strong experience in Schematic Symbol and PCB footprints Library management.•Strong experience in Placement & Routing•In-depth experience/thorough knowledge in all phase of PCB Layout Design.•Basic knowledge of Circuit designing, PCB Layer stackup, PCB Fabrication and PCB Assembly.•Handled Layouts for Multi-Layer High speed PCBs.•Knowledge in multilayer PCB design concepts.•Basic knowledge in Circuit schematics Analysis.•PCB design for Consumer Electronics, Surveillance, Wireless/RF products.Key Responsibilities:•Problem solving/trouble shooting related to the PCB design.•Interaction with Schematic design team, Mechanical design team and PCB Fabricator for the projects•Importing net list from the schematic tool, Schematic DRC checking and error correction.•Design of high speed, Impedance controlled Boards with delay matching and Differential Pairs.•Creation and Maintenance of Schematic Symbol and PCB component Library.•Component Placement and Preparing final layout guidelines.•Routing and Gerber generation and Verification.

1. PCB design process through all the stages from analysis of requirements to the full package of design documents related to PCB layout.Take a PCB design through all the phases from a prototype release to the production release. 2.Designed single-sided, double sided and multi-layered analog and digital Printed Circuit Boards (PCB) using surface-mounted and through-hole components.3.Knowledgeable in micro-via, buried/blind via, and pad-on-via technology and other complex designs using BGA4.Created component libraries based from mechanical drawings and datasheets.5.Familiar with a wide range of components and packages from QFP Sockets to BGA, LGA, CSP and connectors.6.Worked well in a team environment with design engineers, test engineers, and software engineers to design evaluation test boards.7.Tools Worked on: PADS, OrCad, Cadence Allegro, Altium,Eagle 8. Also well in Thermal Analysis using hyper lynx tool9.Well Knowledge of PCB prototype,Mass Production,Component procurement and Assembly details