• Daily sustain all equipment’s for Powertrain Electrics (RTV, CIPG, Automation install device, Gel dispense, conveyors…)• Continue improve OEE by modify the hardware, design a new one for robust production to get high UPH.• Coach and train Production-maintenance technician on new hardware process.• Improve tools utilization by set up right preventive maintenance per FMEA results.• Create parts assembly EMS to improve spending cost and improve the yields.

• Drive manufacturing equipment maintenance and R&D projects efforts, provide ownership for equipment development and related tool issues for specific processes, and improve overall tool cost of ownership and ensure scheduled and unscheduled maintenance is conducted.• Lead and optimize cell fab, equipment maintenance engineering functions, including tool installations, tool modifications, and tool research and purchase recommendations.• Establish and monitor spare part inventory, disciplines, and procedures necessary to increase equipment uptime.• Coach, supervise, train and provide instruction to equipment maintenance technicians and vendors.• Interface with managers, system owners, and equipment and operation teams to clearly communicate any issues, repairs, maintenance schedule, etc.• Responsible for collaborating with process engineer, internal cross-functional teams, and external vendors to maintain, define and improve equipment maintenance to ensure equipment uptime and improve new and existing processes and performance.

Thin Film Electronics, San Jose, CA 4/2015 to 7/2016 Sr. Manufacturing Equipment Engineer• Set up and maintain procedures for repairs, trouble-shooting and maintenance on thin film equipment’s: Oxford PlasmaLab800Plus PECVD Oxford PlasmaLab800Plus RIE Circuits Processing Apparatus (CPA) sputtering system 9900 PVA TePla IoN 100 series• Monitors, sustains, and supports day-to-day thin film manufacturing equipment’s such as preventive maintenance, repairs, improve tool utilization.• Uses Statistical Process Control (SPC) to analyze the equipment utility and make corrective action to improve the efficiency of sputter deposition, dry etch processes.• Collaborates with Manufacturing Process Engineer to qualify new thin film and dry etch processes.• Study and implements practices on equipment repairs, maintenance which reduce cycle time and improve MTBF (means time between failure).

• Maintain and improve thin film and dry etch processing equipments and increase overall productivity of systems in a high-volume semiconductor/MEMS fabrication production line.• Knowledgeable and proficient in the theory and operation of automated, high-volume wafer manufacturing tools:  Applied Materials Endura sputter Etch and Deposition tools. Oxford Instrument PlasmaLab System100 reactive ion etch tools (RIE) PVA Tepla and Anatech Plasma Asher tools. Laser Ablation tools for bulk photo resist remove.• Develop and improve thin film process on AMAT Endura tools, reactive ion etch process on Oxford Instrument PlasmaLab System100. Provide line support on a daily basis to resolve equipment and process issues in a timely fashion to keep the production line running smoothly and effectively.• Sustain manufacturing wafer processes for thin films, dry etch, laser photo resist remove using SPC methods to control and disposition the products.• Manage tool moves, equipment startup and decommissioning as production/capacity needs change. Analyze downtime, MTBF and lead the improvement team to address system reliability and availability.• Responsible for product, equipment and process transfer and driving “copy exact” methodology into manufacturing.• Train and certify maintenance and operations personnel on wafer thin films, dry etch processes, equipment setup, tooling and maintenance procedures.• Assist in scrap reduction (yield improvement), quality improvement, process robustness, cycle time improvement and cost reduction programs.

• Established baseline processes based on R&D results for perpendicular media recording (PMR) production at Milpitas Record Media Organization in a very short period.• Characterized sputter processes and optimized for stability, performance, reliability and cost for thin film media production.• Worked closely with equipment engineers and suppliers to optimize the process/equipment combination.• Used statistical methods such as design of experiments (DOE) to identify parameters for manufacturing yield improvement.• Experienced with large scale manufacturing processes and high throughput, dynamic operation.• Conducted training classes for technicians and operators on process control to ensure quality product output.• Developed the process for sputter machine that enable production to load all disks on sputter pallet. This increased PMR throughput from 49 disks to 56 disks per pallet (14% increases).• Developed sputter process for using the Pinnacle Plus power supply in pulse mode for parameters of frequency and reverse voltage time; this process improved yield by minimize magnetic voids and spits.

• Developed and improved sputter process for high-end media on Intevac MDP250B machines.• Planned and coordinated all new products qualification and processed special manufacturing orders.• Worked with product engineering to qualify product for key customers.• Collected and generated bill of material (BOM), WI and transferred products to Manufacturing.• Worked with manufacturing team for yield improvement.

• Managed EDFA, TLA, and OADM programs for Tycom, Lucent, Zaffire, Alcatel customer from engineering samples to volume manufacturing.• Led and participated in cross-functional team to drive product execution.• Assessed technologies vendors and negotiated external partnerships necessary to support product development activities. Coordinated with Engineering to ensure product readiness.• Responsible for production ramp up plan, materials order, gross margin calculation, equipment's order and set up. Ensured all products are built using correct documentation specifies on engineering change order (ECO).• Worked with Engineering to manage release schedules, track progress and make appropriate tradeoffs between features and timing. Generated working instruction (WI) for assembly.• Organized and managed continue improving team (CIT) for cost reduction and yield improvement.

• Managed NPI/NPT department activities on gas panels’ transition to Austin manufacturing (assembly fixtures, testing fixtures, resources…).• Planned and managed new product transition projects from Engineering, Pilot Line to volume manufacturing.• Worked with Pilot Line Gas Panel prototype system on customer specification (Applied Material machines: CVD, PCVD, Etch, TPE…).• Reviewed gas panel BOM, made red line on drawing and created NCR/ECO to resolve design/manufacturing problems.• Created and validated SOE and OMS for manufacturing assembly.• Developed product synch and process map for new products.

• Led sputter process team to develop new sputter process, which successfully increased 15% production yield and 25% throughput.• Redesigned and strengthened system hardware, which saved $100K for bi-weekly production spending.• Knowledge DOE, SPC tools for process development and production control.• Worked closely with equipment engineers and suppliers to install seven Ulvac and one Anelva in-line, developed process and qualified machines before released to production. • Implemented new carbon process with H2 and N2 doping to improve tribology performance of overcoat.• Developed and improved under layer alloys for better media noise performance.• Co-developed magnetic alloys to meet customer product specifications.