Venkat Kolagunta, Ph.D. Email & Phone Number

Upstate Ny

Malta, Ny

Leading the Fabless Foundry Technology Engineering team. Drive Next node (N7, N5) interaction with the Foundry and manage yield improvements for all products in NPI or Production

Malta, Ny

Successfully Lead 14nm product product launch for lead Customer with accelerated yield step-up. Seamless transition of lead product through multiple mini-nodes to improve product power performance curves. Demonstrate quarter-over-quarter Yield improvement by ensuring the right balance between systematics and defectively reduction by proper prioritization and silicon management in line. Core strength in New Technology Introduction (NTI) and New Product Introduction (NPI) by building… Show more Successfully Lead 14nm product product launch for lead Customer with accelerated yield step-up. Seamless transition of lead product through multiple mini-nodes to improve product power performance curves. Demonstrate quarter-over-quarter Yield improvement by ensuring the right balance between systematics and defectively reduction by proper prioritization and silicon management in line. Core strength in New Technology Introduction (NTI) and New Product Introduction (NPI) by building multi-disclipinary teams that learn to cross boundaries and leverage their expertise on a daily basis.Successful prototyping of multiple new products on 20nm using a matrixed organization.Delivered the 20nm product with a device re-integration to achieve ~10% AC performance boost Show less

Malta, Ny

20nm Prototyping and New Technology Introduction for Fabless customers. Built flawless execution of new product setup flow on 20nm by defining the key quality metrics for every product. Leverage most recent learning to improve product yield without impacting NPI cycle time by identifying key checkpoints for silicon integration. Setup incoming GDS Waiver Review Process for Green Fab to ensure successful NPI and includes building a framework for reduced core checks on incoming GDS.

Co-ordinate Test Vehicle content for 90nm to 45nm technologies including NVM

Manage and implement Test Vehicles for the 90nm - 28nm technologiesManaged the tapeout flow for various new Tehcnology intoductions including embedded NVM technologiesFocused on adoption of the "crucial parameter List", YAT/YWL across various new technologies with focus on technology maturity audits.Work on streamlining Test Vehicle content generation to calibrate silicon models.Implement common best practices including SOW, checkpoints, ticketing systems to manage interactions… Show more Manage and implement Test Vehicles for the 90nm - 28nm technologiesManaged the tapeout flow for various new Tehcnology intoductions including embedded NVM technologiesFocused on adoption of the "crucial parameter List", YAT/YWL across various new technologies with focus on technology maturity audits.Work on streamlining Test Vehicle content generation to calibrate silicon models.Implement common best practices including SOW, checkpoints, ticketing systems to manage interactions acrosss mulitple business units. Show less

Manage the 65nm SOI and the 45nm SOI Device/Integration teams.Built multiple Technical teams to deliver unit performance modulesEmploy clearly defined business processes to define the next generation technologyImprove cycle-time and accelerate engineering learning on silicon by using better business processes and improving on standard analysis toolsDemonstrated success by applying new CPL, YAT/YWL methodologies to move technologies through various maturities.

New Product Introductions90nm SOI: Third Generation SOI technology and fourth generation Copper interconnect technology microprocessors130nm: Highest peforming Bulk technology for Motorola with multi-core for server applications230nm: First generation Copper backend on 6 metal level microprocessor technology. New Technology Introductions/Transfers including Test Vehicles65nm SOI: Owner for Core transistor and technology performance definition130nm: Module owners… Show more New Product Introductions90nm SOI: Third Generation SOI technology and fourth generation Copper interconnect technology microprocessors130nm: Highest peforming Bulk technology for Motorola with multi-core for server applications230nm: First generation Copper backend on 6 metal level microprocessor technology. New Technology Introductions/Transfers including Test Vehicles65nm SOI: Owner for Core transistor and technology performance definition130nm: Module owners for i) bulk and SOI bitcells ii) Contact module iii) High Vt transistors for bitcell230nm: Module owners for i)Copper CMP and ii) Final Metal Cap Show less

Development of MESFET RF devices on SiCDevelopment of fabrication methodology for Static Induction transistors on SiCExtending fabrication techniques developed during Doctoral work on GaAs contacts

Doctoral work on Studying electrical conduction through metal nanometer particles connected through organic moleculesWorked on understanding the self assembly mechanisms of organic molecules and their interaction with metal and/or semiconductor surfacesDoctoral work on fabricating and characterizing low-dimensional conduction in Resonant Tunneling transitors (RTTs).Application of Low Temperature grown GaAs layers in making low resistivity ohmic contacts

B.E, Electronics

Phd, Electrical Engineering

Msee, Electrical Engineering