About 10 years optical semiconductor component process and application filed experience include: 1.5 years experience in Silicon-Photonic chip test and analyze. Include 3dB bandwidth, EYE ,or Optical Sub-Assembly test and analyze. Familiar with test and analyze in semiconductor laser(DML,VCSEL), modulator ,integrated component (EAMSOA, EML, etc) in chip level. (8 year) VCSEL chip process experience 8 years include mask design, process improve, wafer level or chip level test. (optical comunication or consumer application chips)  VCSEL chip reliability and failure mode analyze experience. Had setup VCSEL chip failure mode analysis technical report to help classify invalid chip in TO/TOSA/COB package process flow.  1X4 40G VCSEL flip-array design form wafer structure (co-work with one colleague), chip process, wafer level test, chip on board (Active optical cable) package application. And success in trial production level sell for OE solution, Browave company. Foundry management and communication, include product develop (RND & NPI phase), deal with process or testing problem.