I am currently a Senior Engineer (R&D) in the Thin-film Equipment Division at Hind High Vacuum (HHV) Advanced Technologies Pvt. Ltd., where I provide engineering solutions to enhance the mechanical, optical, and optoelectronic properties of various applications. My expertise spans a range of vacuum deposition techniques, including Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Magnetron Sputtering, Thermal and E-beam Evaporation, and Reactive Ion Etching (RIE).In my current role, focus on process development for Plasma-Enhanced Atomic Layer Deposition (PEALD) of nitrides and oxides using in-house built equipment. I have worked on development of oxide thin-films for diverse applications through E-beam evaporation. I have also worked on decorative hard coating processes using magnetron sputtering. Additionally, collaborated with the design team to engineer a specialized Plasma and Thermal ALD system, applying Ansys Fluent and thermal simulations to optimize designs for ALD and RIE components. My contributions earned me the "Best Employee of the Year (2022-23)" award at HHV.During my time as an Equipment Development Engineer at KAS Technologies, developed processes for Single-layer graphene using CVD, and contributed to the development of Thermal CVD, Plasma CVD, Metal Organic CVD, and Plasma Etching systems.In my previous role as a Process Engineer at PSG Institute of Advanced Studies, led PVD process development for metals, alloys, and compound thin films, focusing on optimization through Magnetron Sputtering, Thermal Evaporation, and E-beam Evaporation techniques.