Vijay Bala

Vijay Bala Email and Phone Number

ASIC Test - Radio and Transport Engineering @ Ericsson
Austin, TX, US
Vijay Bala's Location
Austin, Texas, United States, United States
Vijay Bala's Contact Details

Vijay Bala work email

Vijay Bala personal email

About Vijay Bala

Test Engineer with 20+ years of experience on various industry standard ATEs.Specialties: o Advantest (93K), test vehicles, gpu, apu, mcu, Teradyne Flexo Test program integration and releaseo JIRA, stash, git,rubyo ATE test pattern conversion, first si bringup, characterization, data analysiso pcie, camera, memory test, functionalo Production program release and support (experience in interfacing with offshore contract manufacturers)

Vijay Bala's Current Company Details
Ericsson

Ericsson

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ASIC Test - Radio and Transport Engineering
Austin, TX, US
Website:
amd.com
Vijay Bala Work Experience Details
  • Ericsson
    Asic Test - Radio And Transport Engineering
    Ericsson
    Austin, Tx, Us
  • Amd
    Smts Product Development Engineer - Apu
    Amd Sep 2022 - Present
    Santa Clara, California, Us
  • Nxp Semiconductors
    Principal Test Engineer - Edge Processing (Mcu/Mpu)
    Nxp Semiconductors Mar 2020 - Sep 2022
    Eindhoven, Noord-Brabant, Nl
    o Own pre-silicon and post silicon activities for BIST content for production and characterization.o Responsible for ATE test program and pattern development (via origen sdk), rtl simulations to check pattern readiness and interface with verification team to come up with test sequences for pattern development.o Perform data analysis on test data and present to test and product team to drive improvements.o Mentored new hire test engineer and Intern to come up to speed with NXP processes and test activities.
  • Amd
    Mts Product Development Engineer - Gpu
    Amd Oct 2017 - Mar 2020
    Santa Clara, California, Us
    ATE program owner for dGPU - SW Infrastructure setup; Integration; Standardization
  • Amd
    Mts Product Development Engineer - Test Chip Validation Team
    Amd Jan 2016 - Oct 2017
    Santa Clara, California, Us
    Test Chip ATE Test Lead; Probe Test; Final Test; First Silicon Bring-up; Production test; IP characterization; Reliability Studies; ATE capacity & configuration; DIB design re-use; 93K platform
  • Amd
    Sr. Product Development Engineer
    Amd May 2012 - Dec 2015
    Santa Clara, California, Us
    - ATE Test Program Lead (Verigy/93K) for 20 nm, 16 nm finfet node Test Chips; Wafer Sort, Final Test. * Test HW decisions and ATE configuration owner for wafer and package test. * First Si bring-up, debug, characterization - SCAN, SRAM BIST, RO, Test Transistor structures * Create Bump mapping for ATE. * Influence substrate design for re-use of ATE HW to align to one single package type for test chips- Extensive collaboration with yield engineering to ensure minimum time to data.- Interface with fab/subcons for closing ATE capacity and HTOL requirements.- Always working on next generation process node for drive to yield test chip vehicles(20 nm, 16 ff)
  • Freescale Semiconductor, Austin Tx
    Sr Test Engineer
    Freescale Semiconductor, Austin Tx Jul 2010 - May 2012
    Austin, Texas, Us
    Principal responsibility of delivering production and characterization program for Freescale's network processor; In-depth debug on VERIGY 93K, VERIGY 93K Classic Test Method development;Production support - yield improvement, test time reduction, multisite program conversion
  • Freescale Semiconductor, Austin Tx
    Lead Test Engineer (India Design Center)
    Freescale Semiconductor, Austin Tx Jun 2007 - Jun 2010
    Austin, Texas, Us
    Leading test engineering efforts from India Design center to support next gen QorIQ products.- Responsible for leading the India team to deliver simulated production and engineering patterns to counterparts in Austin.- Design and Develop AC characterization of digital interfaces on VERIGY platform.- Represent India Test team at design reviews, core team reviews and product support reviews.
  • Tessolve Services Pvt. Ltd., Bangalore India
    Senior Test Engineer
    Tessolve Services Pvt. Ltd., Bangalore India Apr 2006 - Jun 2007
    Bangalore, In
    In charge of handling reference program delivery for a niche memory design firm on LTX Fusion-HF platform
  • Teradyne Inc, Boston, Ma Usa
    Test Development Engineer
    Teradyne Inc, Boston, Ma Usa Apr 2000 - Mar 2006
    North Reading, Ma, Us
    IntegraFlex HSD200/HSD100 checker program developer; VBA; IG-XL

Vijay Bala Skills

Debugging Test Engineering Semiconductors Testing Verigy 93k Product Engineering Ic Characterization Yield Electrical Engineering Automatic Test Equipment Asic Project Planning Hardware Architecture Mixed Signal Test Program Integration Git Agile Methodologies Cmos Functional Verification Simulations Analog Atlassian Jira Bist Stash

Vijay Bala Education Details

  • New Jersey Institute Of Technology
    New Jersey Institute Of Technology
    Electrical Engineering

Frequently Asked Questions about Vijay Bala

What company does Vijay Bala work for?

Vijay Bala works for Ericsson

What is Vijay Bala's role at the current company?

Vijay Bala's current role is ASIC Test - Radio and Transport Engineering.

What is Vijay Bala's email address?

Vijay Bala's email address is vb****@****ail.com

What schools did Vijay Bala attend?

Vijay Bala attended New Jersey Institute Of Technology.

What are some of Vijay Bala's interests?

Vijay Bala has interest in Social Services, Children, Environment, Hiking, Music, Worldwide Travel, Investment Planning, Animal Welfare.

What skills is Vijay Bala known for?

Vijay Bala has skills like Debugging, Test Engineering, Semiconductors, Testing, Verigy 93k, Product Engineering, Ic, Characterization, Yield, Electrical Engineering, Automatic Test Equipment, Asic.

Who are Vijay Bala's colleagues?

Vijay Bala's colleagues are Aref Bakhtiyari, Mark Mccollum, Mirko Redeker, Pavan Kumar Reddy Ravipally, Matt Cushing, Sundar Rangarajan, Lindo Kuhle.

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