Design validation and process validation for new MEMS module projectReview error budget of design spec and DFM with NPI team & SupplierCoordinate SFR in CM AA (camera module active alignment) correlate to Final test in image performance and review SFR versus TVL coorelation for image criteriaLead task force to deliver ahead of schedule

• Responsible for overall product management and benefit/cost analysis in new Nikon DSC ODM product lines.• Prepare management plan to coordinate different department function leaders.• Participating in DFM / DFMEA review with engineering team.• Negotiate quality criteria with both customer and factory• Manage the supply chain capability, materials shortage risk probability and impact.

• Responsible for 10 x 10mm, 8.5 x 8.5mm, 6.5 x 6.5mm VCM product lines.• Work with Vistapoint to build 5MP socketable Auto Focus Camera Module.• Contract with MinAik for manufacturing VCM, studying all aspects of insert molding and automation process.• Coordinate with Allegro and Asahi Kasei to develop VCM driver embedded hall sensor for next generation close-loop VCM to achieve repeatability & hysteresis of close-loop VCM to 5um accurate movement.• Work with Hysonic Korea to fine-tune recipe of insert molding and improve VCM static tilt angle less than 0.1 degree.• Contract with Samsung Techwin to develop 8MP Auto Focus Camera Module with M6.5 Lens barrel by using Sony CMOS sensor and Fujitsu ISP.• Initial ultra low cost 2 steps Marco camera for notebook application by using new flexible PCB type coil integrated with hall sensor to reduce both material BOM and assembly process.• Review VCM magnet force simulation to optimize VCM design• Negotiate the specification with both customer and factory• Work with production engineering team to set up automation system and greatly improved VCM manufacturing yield more than 90%.

• Responsible for system infrastructure planning to decide SCSI, iSCSI or Fibre Channel storage subsystem best to meet customer’s budget and growth plans.• Work with NEC to develop fault tolerance and no down time POS RAID system for 7-11 group.• Work with OKI to develop real-time remote back up system in Japan Shinkansen ticketing system.• Work with Fujitsu to build in RAID ASIC for Notebook• Provide cost effective RAID5 controller for Hitachi’ storage server product lines.• Work horizontally within the various customers to maximize revenue potential

• Responsible for i-Line, DUV, ArF, EUV and E-beam photoresist materials in photolithography process with TSMC, UMC, Winbond and MXIC..• Support semiconductor manufactures to improve depth of focus of Lithography process yield. • Provide cost effective photoresist solution for Line/Space and Contact hole pattern.• Support ArF photoresist for TSMC 90nm project to mass production..• Provide special thickness photoresist for MEMS semiconductor process• Kick off 65nm EUV photoresist project with TSMC Lithography and photo mask team.