Vincent Y. Wang

Vincent Y. Wang Email and Phone Number

Vincent Y. Wang's Location
Shanghai, China, China
Vincent Y. Wang's Contact Details

Vincent Y. Wang work email

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About Vincent Y. Wang

Vincent Y. Wang is Chief Innovation Officer (CIO) of China Wanxiang Holdings, and CEO of the leading blockchain player in China, Wanxiang Blockchain Inc. Vincent was Previously the General Manager of IBM Business Development reporting directly to the Chairman of Greater China. Throughout almost three decades of his career, Vincent held a series of executive positions at leading multinationals incl. Intel, Infineon and SMIC, and he co-founded Tangram Technologies Inc. Among his professional honors are Intel’s highest R&D recognition, Gordon Moore Award, and CES 2014 Best Innovation Award. Vincent holds an MBA degree from UC Berkeley, Master of Science in Material Science & Engineering from University of Southern California, and Bachelor of Science in Physics from University of Science and Technology of China.Strengths: visionary strategy and ecosystem leader in tech sector. Chief architect of marketing and ecosystem strategy. Strong sales leadership and demonstrated track record of rapid P&L growth. Vertically-integrated global technology management tool kit, from tech development, UX design, to product marketing. Expertise on Blockchain, Digital Assets, Web3.0, Semiconductors, Internet of Things (IoT), AI, Big Data, Next-Gen Comm Infrastructure, Digital City, etc.Corporate entrepreneur of proven capabilities and execution. Established track record of initiating and building corporate ventures to success.Vincent is a US citizen with native English proficiency. His polyglot portfolio consists of four languages that include French and German. Experienced and bold China strategist for US and EU-based multinationals. Skillful government partnership negotiator and deal-maker. Aggressive and imaginative industry alliances builder.

Vincent Y. Wang's Current Company Details

Vincent Y. Wang Work Experience Details
  • China Wanxiang Holdings Co.,Ltd
    Chief Innovation Officer
    China Wanxiang Holdings Co.,Ltd Mar 2017 - Jun 2023
    Shanghai, China
    - 中国万向控股: Lead Wanxiang's Innovation and Entrepreneurial platform globally, from strategic partnership, ecosystem development, incubation/acceleration, to venture investment. - 万向集团:Chief Architect for Innova City (创新聚能城), the 5100-acre flagship project in Hangzhou. Successfully secured government support for this mega-project from Provincial Governor, Hon. Jiajun Yuan (袁家军). The winning blueprint incorporates advanced urban design, Smart City 3.0, and forward-looking transit system innovation. - Created a strong global ecosystem for Innova City continuing leadership in urban innovation and smart city technology landing, with technology partnerships incl. Siemens, Microsoft IoT, Cisco and MIT. - Chief Architect for Wanxang’s Industrial Technology Initiative, incl. establishing an industrial IoT presence via innovative prototypes, IIC and AII alliance, and design and development of a worldwide ecosystem platform.
  • Wanxiang Blockchain Inc.
    Chief Executive Officer
    Wanxiang Blockchain Inc. Jan 2020 - Mar 2023
    Shanghai City, China
    - 上海万向区块链公司:Lead China’s top blockchain company in ecosystem and technology, with a strong and vibrant organization, and innovative process and mechanism design. Championed blockchain infrastructure for Web3.0 in China and Singapore, incl. strategic partnerships with Singapore’s premium urban living lab, the flagship Punggol Digital District under JTC, endorsed by Hon. Heng Swee Keat, Deputy PM of Singapore.- Doubled company revenue every year in 2020 and 2021, and secured a 15% growth in the challenging year of 2022. - Build WBI into China’s leading innovator in blockchain industry applications, with 15 Industry Firsts and 5 profitable product lines, in blockchain finance, industrial internet, renewable energy, digital urban infrastructure, and livestock assets. Created the award-winning Distributed Cognitive Industrial Internet Platform (RMB 11M in the 1st year). Won 3 government contracts with Metaverse implementation in Shanghai.- Founded Blockchain Industry Workgroup under RISC-V Global Foundation, the first of its kind in semiconductor industry, bringing open silicon and open distributed data infrastructure together.- Renowned KOL and evangelist in Web3.0, DAO, digital governance, smart city.
  • Ibm
    General Manager, Business Development, Greater China
    Ibm Mar 2016 - Feb 2017
    Shanghai City, China
    - Directly reporting to Chairman of IBM Greater China, to deliver the region’s global technology landing, strategic partnership, and new business model development. - Lead IBM Blockchain ecosystem building and platform offerings. Head of 36-ppl team from Marketing, BD, Business Consulting, to R&D. Created industry-leading footprint for HyperLedger and IBM Blockchain platform, from scratch, in 7 months. - Drive IBM Cognitive Health strategy in China: intimate knowledge of China’s health and pharmaceutical ecosystem. Created 2 initiatives on IBM Global level for strategic differentiation through new technology integration into Watson Health platform.- Develop market opportunities for IBM Watson, Internet of Things and Cloud platforms. Broker partnership with Wanxiang, Wanda, CEC, among others.
  • Undisclosed Technology Venture
    Co-Founder, Chief Strategy Officer & Vp Of Marketing
    Undisclosed Technology Venture Jul 2014 - Jan 2016
    Shanghai City, China
    • A leading-edge smart platform company that sells to the vibrant wearable and IoT markets.• Created a winning business plan and secured angel and venture capital funding.• Successfully lobbied for and secured Shanghai Municipal Government support. Became an instrumental piece in China’s recent initiative to turn Shanghai into a world-class hub of innovation. • Built core team and created BD & marketing plan. Negotiated critical licensing deals and key strategic partnerships.
  • Intel Corporation
    Deputy Managing Director, Intel Labs China 英特尔中国研究院 副院长
    Intel Corporation Jul 2010 - Jun 2014
    Shanghai City, China
    Gordon Moore ("Gordy") Award Winner, 2014: Intel highest global distinction for technology innovation.A. Strategy. Led Intel’s China technology strategy. Created Intel’s Technology Leadership Program. Ran Intel’s China tech think tank with Intel’s CTO office.B. Innovation. Business architect of Intel Edison program, a new compute class for Maker and new device innovation, debuted by Intel CEO at CES 2014. - Responsible for the conceptual creation and UX design for the award-winning Edison pluggable module and platform (four CES 2014 awards, incl. “Best Innovation”).C. Corporate Ventures. Created and led two successful Intel CVs, (1) Edison, and (2) Pocket Avatar (new UX based on visual computing). Effectively lobbied Headquarter executives (incl. CEO and CTO) via business plans, F2F presentations to Management Committee, and well-documented updates, securing seed and follow-on corporate investments (over $8.5M). D. China Ecosystem: founded 2 joint research institutes: - China Intel IOT Research Institute: April 2012, w/ Chinese Academy of Science, Tsinghua, and Beijing Municipal Government; the largest of its kind, w/annual funding of USD 6 million for 5 years. - Intel Collaborative Research Institute (ICRI) on Mobile Networking and Computing: April 2013. This is the 1st-ever Intel research institution in the area of telecomm/data infrastructure convergence, covering Collaborative Radio Access Network (CRAN), E2E radio networking, etc.E. Leadership. Owned all strategic liaisons with business groups at US Headquarter. Secured BU sponsorship for technology initiatives. Built cross-functional teams and led 2 critical programs in the area of mobile platform architecture and user experience innovation. Established trusting and productive high-level executive relationships within leading technology companies in China, incl. China Mobile, Huawei, TCL, Lenovo, Haier, SARFT, China Telecom and Unicom. Built 4 productive technology design-win platforms.
  • Infineon Technologies
    Sr. Director, Marketing & Sales
    Infineon Technologies Sep 2007 - Jul 2010
    - Head of Infineon’s ASIC and Power IC group. Responsible for Infineon’s power IC and ASIC business, including account creation, business development, marketing, and P&L management. Key accounts: BYD, Huawei, ZTE, Lenovo, etc. - Leadership. Assembled task forces across Infineon to address ASIC project needs, from IC design engineers to product marketing personnel and FAE, and led them to success.- Government Relations. Built extensive and deep relationship network within China’s broadcasting (SARFT), telecommunications (IIM), and industrial semiconductor (via CASC) markets: excellent government and industrial liaison. - Corporate Venture. Co-founded Telepath Technologies Limited, the result of a partnership between Infineon and China’s Academy of Broadcasting Science. Telepath became the leading supplier of CMMB digital mobile TV solutions.
  • Smic  (Semiconductor Manufacturing International Corporation)
    Director, Corporate Sales,
    Smic (Semiconductor Manufacturing International Corporation) Jan 2005 - Sep 2007
    · Responsible for account development of a leading semiconductor corporation, one of SMIC’s strategic customers. Managed contract drafting and negotiation, business model definition, and turnkey program enablement. Business volume ~ US$ 120 million.· Led negotiation with a leading US IDM on pricing, program management, and strategic engagement in China. Business volume ~ US$46 million /year.· Built strategic engagement model with China-based system houses, through creative restructuring of IC supply chain.· Built partnership with IBM and Infineon in ASIC partnership for China market, through strategic lobbying, business negotiation, and co-exploration of prospective mutual customers.
  • Smic
    Director, Business Integration, Marketing/Sales,
    Smic Jul 2003 - Jan 2005
    · Founded B.I. Department. Spearheaded strategic marketing, targeting at China and European fables and system houses.· Championed the concept of Solution Platform. Constructed SPs for 5 leading applications in China and global market.· Managed technical sales activities for leading US accounts, incl. 3 companies with combined annual corporate revenue > $5Billion, and major DTV chipmakers.· Built wafer volume from 0 to 3.5K/month (Account A), and from 600 to 5K/month (Account B).
  • Micrel
    Process/Product Manager
    Micrel Aug 1995 - Sep 2001
    · Managed development and production of all 17 BCD2 custom products that represent the leading edge of Micrel’s analog technology. Total revenue grew from $3M (97) to $28M (Q2,’01).· Improved new product lead-time from 6 to 3.5 months, and average yield from 78% to 92%.· Initiated and directed successful re-negotiation with foundry customers on both price and specs. Increased responsible foundry revenue from $12M to $19M, and profit margin from 37 to 45%.Senior Product /Process Engineer, 7/95-5-97.· Spearheaded process development for 3 foundry bipolar product-lines. Introduced 8 new products.· Responsible for the yield improvement and fab trouble-shooting for 2 major std. BiCMOS product-lines, incl. 12 products. Coordinated lot turnover improvement from 11 to 8.5 weeks.· Received two Outstanding Performance ratings and merit promotions.

Vincent Y. Wang Education Details

Frequently Asked Questions about Vincent Y. Wang

What is Vincent Y. Wang's email address?

Vincent Y. Wang's email address is vi****@****eon.com

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Vincent Y. Wang's direct phone number is +49 800 9519*****

What schools did Vincent Y. Wang attend?

Vincent Y. Wang attended University Of California, Berkeley, Haas School Of Business, Stanford University, University Of Southern California, University Of Science And Technology Of China.

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