Lead electrical engineer collaborating with teams in US and China to define and design portable power solutions for one of the largest wireless service provider in the US.

Part of a small design team specializing in hardware design, integration, and validation of IoT devices and cellular devices. • Lead digital engineer for designing and validating microprocessor interface, memory interface (DDR, eMMC, QSPI), USB interface, Proximity sensor interface on the main interface circuit board for IoT appliances.• Responsible for overall power design, layout and validation on the main interface circuit board for IoT appliances.• Responsible for test plan documentation and validation of processor, memory, USB and sensor interfaces on the Blackberry Leap phone.• Performed stress analysis on the major components of the IoT board.• Root cause and resolve issues related to ESD on blackberry Leap phone.• Responsible for driving the design, schematic capture, and layout of FPCs on various products.• Experience with collaborating with overseas engineers in Taiwan and Mexico, supporting numerous prototype and production builds in Taiwan and Mexico.

• Responsible for audio performance, haptics, and ESD on the Motorola Droid Razr.• Implemented and optimized active breaking circuitry on the Motorola Droid 3 phone.• Responsible to drive the intensive testing and identifying failures in electronics due to Electro Static Discharges (ESD) and resolving the issues using several techniques involving PCB layout modifications, adding TVS protection devices, and techniques involving grounding improvements. • Responsible to validate and optimize audio performance on cell phones. Working knowledge of loudspeaker, earpiece speaker and microphone circuitry. Experience in testing and optimizing Audio buzz in cellular phones.• Experience in testing and evaluating acoustic performance of loudspeaker, earpiece speaker and microphone using HATS (Head and Torso Simulator) and artificial ear.• Experience working on the flip board PCB. Familiar with part placement, schematic capture, critical routing techniques, and generating Bill of Materials placed on the board.• Experience working with several engineers in China, supporting the prototype and production builds overseas. Responsible for assuring a smooth launch, resolving any intermittent issues.• Experience investigating Audio, or any flip (including Imager, display and the CLI) related factory failures and creating Failure Analysis reports. • Experience interacting with various vendors on their current and future product roadmaps. • Familiar with Advance Digital Radio (ADR) laboratory specifications and requirements related to ESD and EMI.