Vincent Manoogian Email & Phone Number

• Maintaining computing equipment, and network infrastructure.• Performing backup and restore of critical operational data.• Updating and maintaining computing software.• Management of user/email accounts, and mailing lists.• Specification and implementation of security policies.• Administration of G Suite for non-profits account.• Administration of Microsoft Office 365 Business Premium (non-profit) account. • Specification, purchasing, and provisioning of computing… Show more • Maintaining computing equipment, and network infrastructure.• Performing backup and restore of critical operational data.• Updating and maintaining computing software.• Management of user/email accounts, and mailing lists.• Specification and implementation of security policies.• Administration of G Suite for non-profits account.• Administration of Microsoft Office 365 Business Premium (non-profit) account. • Specification, purchasing, and provisioning of computing and network hardware/software.• Training and supervision of IT interns.• IT budget planning. Show less

• Maintained computing equipment, and network infrastructure.• Updated and maintained computing software.

• Developed and debugged production test programs for DDR3 SDRAM wafer test including redundancy analysis.• Developed fusing data converter for wafer level chip repair and parameter adjustment.• Developed bitmapping tools for failure analysis.• Assisted in debug of DDR3 SDRAM wafers.• Successfully worked on project teams resulting in release of 2 memory device types into mass production.

• Developed and debugged production test programs for core test of DDR2 SDRAM packaged components.• Assisted in debug of DDR2 SDRAM packaged components.• Successfully worked on a project team resulting in release of 1 memory device type into mass production.

• Designed and debugged test fixturing for 16-bit MCU products.• Developed and debugged 16-bit MCU production test programs (wafer / package).• Developed first IDAC testing for 16-bit MCU at RTA.• Published 16-bit MCU test specifications.• Performed characterizations of 16-bit MCU (including peripherals).• Involved in successful transfer of 5 MCU device types into mass production.• Functioned as group leader for test and evaluation.

• Designed and debugged test fixturing for 8-bit MCU products.• Developed and debugged 8-bit MCU production test programs (wafer / package).• Developed first embedded flash memory testing for 8-bit MCU at MELA.• Developed USB testing for MELA’s first 8-bit USB MCU product.• Published 8-bit MCU test specifications.• Performed characterizations of 8-bit MCU (including peripherals).• Involved in successful transfer of 4 MCU device types into mass production.

• Developed all memory (DRAM, SDRAM, and CDRAM) module test programs for production.• Developed the MCC M-1X test system for memory module production test. This resulted in capital investment savings of 75% per tester.• Designed the user interface software for the discrete device test systems, which improved the ease of operation, and reduced setup error.• Developed real-time monitoring of contactor performance in discrete device test.• Performed as UNIX system administrator for… Show more • Developed all memory (DRAM, SDRAM, and CDRAM) module test programs for production.• Developed the MCC M-1X test system for memory module production test. This resulted in capital investment savings of 75% per tester.• Designed the user interface software for the discrete device test systems, which improved the ease of operation, and reduced setup error.• Developed real-time monitoring of contactor performance in discrete device test.• Performed as UNIX system administrator for the tester network.• Developed tester network improvements to improve data gathering capability. These improvements encompassed module test, discrete device test, and wafer test.• Developed auto-disposition software for lots at wafer pre-test.• Designed probe cards for wafer test.• Performed qualification, and periodic audits of module assembly / test subcontractors.• Trained and supervised a module test engineer. Show less

• Designed test fixturing and programs for module test on the Teradyne J937 tester.• Reduced test time for memory modules by tracking failure history.• Designed the user interface software for the memory module test process.• Implemented SPC to track test fixture performance in memory module test.• Originated memory module test process specifications.• Coordinated vendor activity in upgrading burn-in systems for MCU and SRAM.• Developed failure analysis tools for the… Show more • Designed test fixturing and programs for module test on the Teradyne J937 tester.• Reduced test time for memory modules by tracking failure history.• Designed the user interface software for the memory module test process.• Implemented SPC to track test fixture performance in memory module test.• Originated memory module test process specifications.• Coordinated vendor activity in upgrading burn-in systems for MCU and SRAM.• Developed failure analysis tools for the memory module test process.• Supervised two test engineers (MCU and wafer). Show less

• Originated and updated operation manuals for testers and burn-in systems.• Established and monitored the preventive maintenance procedures for testers and burn-in systems.• Introduced a burn-in board tester to check for bad sockets off-line.• Coordinated vendor activity in upgrading burn-in systems for DRAM.• Performed qualification of test subcontractors for test and burn-in process.

• Decreased wirebond downtime and increased utilization to 95%.• Improved wirebond loop shape and reduced the requirement for 100% visual inspection.• Developed wirebonder adjustment procedure manual.• Overseen wirebonder and diebonder preventive maintenance.• Developed flow charts for wirebonder error correction.• Trained line operators and technicians on the wirebond equipment.

• Set up the first 16 wirebonders that MSAI used for memory IC assembly.• Trained the line operators on the wirebond process and how to run the wirebond equipment.• Trained the Quality Department to be able to verify wirebond integrity.• Performed maintenance of the wirebond equipment.

• Performed final test on discrete DRAM.• Received six month training in Japan for IC assembly processes, wirebonder setup, adjustment, and maintenance.

B.S., Electronics Engineering Technology

Activities and Societies: Amateur Radio Club (WB8PEN) President, Amateur Radio Club (2 years).

Continuing Education

Certificates of Completion: • Introduction to Ajax Programming, 10-Dec-2010 • Introduction to Ruby Programming, 10-Sep-2010 • Introduction.

Diploma, Technical Electronics

With Honors.