Managed the CAD group and offered support to the Physical Design teams for NetList-2-GDS activities in India and w/w. Rolled out updated flows and drove methodology changes across multiple SoC groups, including Test Chips. Developed and deployed automated Physical Verification solutions for w/w TO teams at advanced nodes (16,14,7) across Foundries ; including multi-die 2.5D/3D packaging advanced verification for mixed node SoCs with chiplets.

Key decision responsible for product user experience for host of applications and software products. Define vision and strategy at Experience application vertical and drive it through R&D teams and Product Owners for execution.In addition....Identify, propose and manage key existing software products shipped on the device. Own roadmap for new/existing applications to support next generation Symbian mobile phone platforms. Drive key elements of UI design to support new UI paradigms and/or enhanced use-cases and new product personas due to the evolving social networking phenomena. Priortize and drive new product requirements in Agile/Scrum mode by working closely with Bangalore R&D/Test teams and other internal stakeholders in various geo sites. Negotiate with external 3rd party vendor deliveries to align with Nokia releases.Work with global and regional Sales/Marketing to enable Go-To-Market strategies.

Phase II - Nov. 2003 - Feb 2008 Cadence Noida, India*I set up a two new Design For Manufacturing (DFM) R&D groups in Noida site for Extraction and Analysis product lines. Extraction product was a flagship IC backend product (QRC) which has $MM annual revenue and 100s of customers worldwide. *The projects/groups I led/managed had multi-site, multi-project responsibilities for not only new alogrithm development, but also close interaction with Configuration and Quality groups before final release to customer use. *Value chain transitions..since new engrs. for this group came from different backgrounds including non-EDA, I moved up the new Extraction group in value chain globally by steadily doing higher order customer requested feature level work, instead of only servicing bugs. *Won team/individual awards and represented them in internal company conferences. As business objectives changed, seamlessly moved Noida team to global R&D resource pool and later to sister groups. *Team was well trained/experienced in all product life stages and had developed many best practices for development and quality assurance of their own and released it for others use.Phase I - December 1999 – October 2003 Cadence/Simplex SolutionsSenior Member of Consulting Staff Member of Techincal Staff*Managed the development and release of next revision of commercial Full Chip(VLSI) IC parasitic extraction tools (trade name Simplex QX) for Cell Based SoC designs. *Worked as key Indv. Contributor along with Principal Architects and CTO on RC Extraction codes for many many improvements for 2-d/3-d geometry scan engines for Manhattan and X designs. *Worked with larger R&D team and Sales/Service Mgmt teams to ensure product was released/accepted by end customers with competitive performance and accuracy goals. *Managed the deliveries from French R&D team for seamless integration to ongoing product releases.

-Proposed and directed Device and Semiconductor Process modeling software products.-Proposed new GUI and Solid Modeling tools based on ACIS and advanced Meshing Software Tools.-Solutions developed and shipped later as part of Synopsys tool sets.

- Key and original developer in new product version of High Frequency Structure Simulator (trade name HFSS 5.0), - Product successfully targeted for EEs working in High Frequency, RF-Analog domains. - Focus on Computational geometry algorithm implementation with single point responsibility for assembly of solids and adaptive mesh generation.-Product commercialized as a shrink-wrapped 3D Graphics, CAD Software product on Windows PC, NT and UNIX platforms by HP and circa 200x became part of ANSOFT tools,

Worked at GE - General Electric Corporate R&D Center, Upstate, NY, USA. - Developed automatic 2D-3D Tessellation software for CAD, CAE-FEM analysis using Delaunay, QUADTREEs, OCTREEs for tetrahedron and other types of meshes-Mechanical CAD software development- Integrated 3D Medical Imaging i.e., CT, MRI scan data to CAD-Surface Model FEM for Bio-Medical, ElectroMagnetic, Mechanical Analysis. Commercialized as a product ten years later by other players. - Integrated external and internally developed technologies for Computer Graphics, CAD software, FEA solvers and others such as ANSYS, NASRTAN, IDEAS for Aerospace R&D and other GE Business Units.-Published papers in Journals/Conferences.