Wade Bantz work email
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A distinguished senior-level Engineering/Program Manager with extensive experience in Program Management, Project Management and Project Engineering. Expertise in managing projects within Engineering, Marketing, Manufacturing and/or spanning a business organization. Solid background directing program teams in development of new equipment to meet marketing and technical specifications. Proven ability to bridge technology and business goals to provide productive solutions. Demonstrated success leading and mentoring cross-functional teams residing in multiple locations in order to maximize levels of productivity. Experienced interfacing with key functional areas including Marketing, Finance, Operations, Human Resources, Manufacturing and Engineering in a multi-cultural global arena. Excellent communicator, with emphasis on building strong customer relationships. Capable of making and delivering professional presentations. Quick learner that rapidly adapts to emerging technologies.Specialties: ● Engineering Management● Program Management● Project Management● Project Engineering● Design Integrity● Supplier Management● Strategy Development● Tactical Execution● Team Building● Team Mentoring● Product Management● Product Marketing
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Technical Program ManagerLam Research Corp 2010 - PresentFremont, Ca, Us -
Senior Project/Program ManagerTap-A-Pm May 2008 - PresentUsTap-a-PM is your source for Project and Program Management consulting and permanent employment. Each experienced, educated, and skilled team member can hit the ground running to achieve project success and build lasting project and program management processes. Current roles for myself include participating in the development and delivery of an online training course for earning a PMP and facilitating employment research for TAP-a-PM members. -
Program ManagerBae Systems Aug 2008 - Sep 2009London, GbProvided PM support and met all budget, schedule and technical performance objectives for a group of advanced technology programs that related to the Army’s Future Combat Systems program. These included Near Autonomous Unmanned System (NAUS), Robotic Counter IED System (RCIS), Electro-Magnetic Armor Generator (EMA-Gen), Armed Robotic Vehicle (ARV), Power and Energy Systems Integration Lab (P&E SIL).• Conducted the NAUS Capstone Demo earning strong praise from the customer, TARDEC.• Co-authored a NAUS paper with TARDEC PM which was selected for presentation at the NDIA-GVSETS in 2009.• Wrote Partial Termination Proposal for NAUS which was accepted at first introduction by the government.• Selected to represent BAE at the National Robotics Engineering Center Autonomous Platform Demonstrator Critical Design Review.• Trained Project Engineers on how to conduct financial analysis for P&E SIL and RCIS.• Took lead role in preparing a proposal to TARDEC in the area of SiC Power Electronics. -
Senior Program ManagerAsyst Technologies Feb 2007 - Feb 2008UsManaged the Falcon Loadport Program. Assembled a matrixed team of >45 members. Led the program through BP, C&F and alpha phases. Achieved a cycle time for design start to customer demonstration of <120 days. Achieved a >50% cost reduction on production based pricing as compared to the current product. -
Senior Engineering ManagerApplied Materials Jul 2005 - Jan 2007Santa Clara, Ca, UsManaged the Epi KPU chamber engineering team. Was responsible for on time performance of all Epi KPU engineering activity. Served as the primary interface to FEP Central Engineering and Synexis resources. Concurrently managed a team of engineers at GDC India that supported the Epi KPU engineering activities.• Project Manager for the Siltronic JDP.• Program Manager for the 300mm Lamp Module Improvement Program. -
Senior Customer Programs ManagerApplied Materials Feb 2003 - Jul 2005Santa Clara, Ca, UsManaged the Logic Customer Programs for the Epi KPU. Consisted of managing all the activities related to acquiring and maintaining the business with the Epi logic customers. Primary focus was on Intel, TSMC and Micron. Additional tasks included top level management of the KPU Programs in the areas of budget, timeline and schedule maintenance/compliance.• Managed a matrixed team of >40 members.• New product penetrations were achieved at all focus customers and resulted in follow on tool orders.• Developed new program planning tool to integrate all of the KPU Programs. -
Senior Product Marketing ManagerApplied Materials Feb 2002 - Feb 2003Santa Clara, Ca, UsManaged marketing for the Epi KPU. Tasks included producing technical symposiums, maintaining product roadmaps and COO models, performing sales training, preparing customer presentations and market sizing analysis. Mentored the person who assumed my previous role. Served as the GPM authority for all ECO activity.• Raised ASP for the 300mm Epi ATM tool by 20%.• Customer visits included IBM, SEH, SUMCO, Komatsu, Micron, Wacker, Canon and Elpida.• Hosted sales training provided in China, Japan, North America, France and Germany.• Produced and hosted Technical Symposia in Japan, North America and Europe. -
Senior Engineering ManagerApplied Materials Dec 2000 - Feb 2002Santa Clara, Ca, UsManaged all engineering activities for the Epi KPU. Continued as the 300mm ATM Epi Program Manager. Selected to manage the low temp. Epi (LTE) program. Managed the relationship with Central Platform Engineering to determine the Systems Engineering activities. Served as DEA for all ECO activity. Approved all purchase requisitions for the Epi KPU.• Program managed the Epi 300mm ATM tool to a >90% market share position.• Through close customer start-up management positioned the 300mm Epi ATM tool to have the fastest start up time of any AMAT tool.• Implemented a checkbook system to monitor KPU expenses.• Managed through a staff reduction from eight to three. -
Mechanical Engineering ManagerApplied Materials Sep 1997 - Nov 2000Santa Clara, Ca, UsManaged the Mechanical Engineering team in the Epi Division Modules Engineering Group. Was able to form a team in three months with individuals from Epi, CES, RTP and HTF fully trained on a common CAD platform, familiar with Epi business processes and releasing documentation on a new ECO system (LEAP). Established a solid framework for the Modules Engineering Group including detailed project tracking tools, regular meetings, and a library to record our engineering work.• Developed a “virtual organization” to meet variable resourcing requirements for the 300mm re-packaging program and support the concurrent engineering philosophy that was utilized.• Program managed the Epi 300mm program for product demonstration at Semicon West 2000 and product release by the end of FY2000.• Produced a lab tool and two customer tools as engineering builds to meet tight timelines.• Served as the LEAP Champion for the Division. -
Senior Mechanical EngineerApplied Materials Apr 1995 - Sep 1997Santa Clara, Ca, UsLed the mechanical engineering team that developed the 300mm Epi chamber. Primary responsibility was on the Chamber Main Body, Upper Lamp Module and the Chamber Process Kit. Designs were completed on time and functioned per the specifications. Duties involved design, documentation, procurement, testing and product release.• Chamber design reached process specifications by wafer #8. • Responsible for all FEA work that was performed on the critical chamber components.• Established a chamber test facility for process testing of the new chamber designs.• Developed and established relationships with new suppliers to cut prototype material lead times by up to 50%. -
Project Engineer 3Applied Materials Aug 1993 - Apr 1995Santa Clara, Ca, UsManaged several projects in the Manufacturing Technology Development Group/AMET/WMO. Duties involved identifying key cost reduction opportunities, determining feasibility, design or re-design, supplier selection and assessment, supplier negotiating, first article testing, ECO generation and production cut in monitoring. Opportunity identification and feasibility assessment of parts were performed by estimating them with a “should cost” model that was developed within the group. Alternate methods of manufacturing were evaluated for their appropriateness. High supplier interaction was required as well as a knowledge of supplier capability.• Utilized electroforming to produce a water cooled chamber reflector. This change in manufacturing method represented a 50% savings over the contracted price of the previous part.• Should cost evaluation and negotiation produced a >$2K in savings on the HTF Chamber Rotation/Lift Assembly. -
Mechanical Engineer 3Premier Microwave Mar 1991 - Aug 1993Held a broad ranging position that primarily consisted of managing a family of specialized electromagnets that were used for focusing linear beam microwave tubes and cross field devices, in laboratory magnet coils and in semiconductor equipment. Key components of the job were magnet design, program management, and manufacturing support.• Designed a second generation ARSR magnet that weighed 45% less, produced 12% more field and consumed 8% less power.• Designed a magnet used by Lam Research that produced a 45% higher field than the previous suppliers unit in the same size package.• Successfully administered production for the Nexrad and TDWR programs. Conducted the ASR, ARSR, Lam Research and Varian Oncology programs.• Implemented an electronic data transfer system to send CAD files to suppliers. Non-recurring engineering costs were cut by an average of 50%.• Changed welding procedures on magnet products which reduced welding time by 1/3 and rejection rate to less than 1%.
Wade Bantz Skills
Wade Bantz Education Details
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University Of California, Santa CruzProject And Program Management -
California State University, ChicoMechanical Engineering
Frequently Asked Questions about Wade Bantz
What company does Wade Bantz work for?
Wade Bantz works for Lam Research Corp
What is Wade Bantz's role at the current company?
Wade Bantz's current role is Technical Program Manager.
What is Wade Bantz's email address?
Wade Bantz's email address is wa****@****ast.net
What schools did Wade Bantz attend?
Wade Bantz attended University Of California, Santa Cruz, California State University, Chico.
What skills is Wade Bantz known for?
Wade Bantz has skills like Cross Functional Team Leadership, Engineering Management, Program Management, Semiconductors, Testing, Manufacturing, Project Management, Product Management, Pmp, Integration, Engineering, Product Development.
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