Built and managed test engineering team with 10+ domestic and global (China and Brazil) direct reports. Verified embedded code for telecom equipment (data networking, video, voice, user interface). Collaborated with Product Management and Systems Engineering on project plans for new features (requirements, platform development coordination, cross-team reporting).Architected board designs (BPON & GPON) incorporating FPGA, clocking, power, and optics. Analyzed requirements and monitored all board building processes. Led EMI and thermal testing. Established predictable deliveries.SELECT ACHIEVEMENTS:• Provided cutting-edge FTTH (Fiber-to-the-Home) technology early and reliably. Designed and built large boards with high-speed logic despite stringent demands on power consumption. Developed reputation for on-time delivery and minimal prototype spins. (Lead Engineer)• Created testing process (none in place) later adopted across the whole organization. Enabled identification of field bugs and development point-of-entry, and consequent preventative measures establishment. Reduced CFDs (Customer Found Defects). (Software Testing Lead)• Established successful global SW test group from the ground up. Defined cross-ocean communication paths and equitable work distribution strategies. Team provided reliable test coverage for GPON product. (SW Testing Manager)• Led team that developed GPON OLT card for flagship Datacom C7 chassis after acquisition. Managed HW Engineers (platform development based on existing OSI design) and SW Engineers (embedded code and interfaces to existing system creation). Product line became largest segment of company sales. (HW / SW Development Manager)

Defined use cases, specifications, and design documentation with Hardware and Software Development, Marketing, and customers. Created client-facing chipset documentation for evolving ADSL product line (DSP & RISC systems). Documented API design with TI Developers.SELECT ACHIEVEMENTS:• Made SOC useful as network processer by basing product on TI's high-end DSP core with enhanced communications interfaces, buffer management, and data handling.

Performed board design for early high-speed telecom, Fiber-to-the-Curb product. Architected broadband modem card, ESD protection board, and backplane bus.SELECT ACHIEVEMENTS:• Completed, as team of 4, new product line on short schedule with minimal project-specific experience (product critical to rapid organizational ramp-up). Learned multiple board functions—including implementation and documentation—rapidly, with minimal support. Completed product on time and earned financial reward for efforts.• Designed modem board with industrial temperature requirements and low skew clock distribution scheme. Worked with microcontroller, serial peripheral interface for card inventory, SAR and DAVIC modem ASICS, modem front end filter, and GR1089 protection devices.• Modified high-speed backplane, resulting in noise reduction on DAVIC lines.• Designed CPC (Coax Protection Card) to successfully mitigate environmental ESD damage from customer-facing interfaces.

Led engineering team in design, build, and testing of FPGA based telecom board. Designed DS1 for FITL (Fiber-in-the-Loop) systems and E1 interface cards. Defined Channel and Drop testing capabilities, fault isolation, and digital interfaces. Specified platform design for use in international applications. Performed integration and certification tests to ensure product market-readiness. SELECT ACHIEVEMENTS:• Developed high-functioning HFC system architecture as design team member. Specifically handled platform component (Telcordia requirements for telephony TR909, TR1089) and control protocol design for managing remote devices on network.• Architected successful modifications to domestic HFC (Hybrid Fiber/Coax) product for international application.