• Spearheaded the recruitment and development of a 15-member engineering team, establishing and qualify both Frontend and Backend lines from the ground up.• Led a cross-functional team, integrating process and equipment expertise, to manage multiple high-stakes projects in a dynamic environment, successfully securing supplier qualification with two major clients.• Conducted research on emerging technologies and innovative processes to enable the production of next-generation products.• Streamlined resource allocation by evaluating project priorities and matching them with team skill sets; improved communication channels between stakeholders across departments, including marketing, NPI, operations, quality assurance, and customer relations.• Set organizational objectives and implemented KPIs to monitor and enhance operational efficiency.Expertise: Frontend processes: PVD (Evaporate / Sputter coating), Photolitho process (resist coating/lamination, exposure, developing), etching, liftoff, resist strip off, etcBackend processes: dicing, die attach, wire bonding, die sort, plasma, laser singulation, pick & place, and AOI, etc.

• Led the development of new products and processes within semiconductor Frontend and Backend operations.• Coordinated with the NPI team to ensure a seamless transition from process development to full-scale manufacturing during the final stages of projects.• Set and aligned individual and team goals with departmental and organizational objectives, holding team members accountable for their performance and contributions.• Developed and submitted annual equipment budget plans, provided capital expenditure recommendations to senior management, and oversaw the control of approved budgets.Expertise: Frontend processes: Photolitho process (resist coating/lamination, exposure, developing), etching, liftoff, resist strip off, etcBackend processes: dicing, die attach, wire bonding, SMT, die sort, plasma, laser singulation, pick & place, and AOI, etc.

Joined the Singapore R&D division as part of the pioneer batch, and underwent comprehensive and intensive process and equipment training at the US HQ to build expertise in cutting-edge technologies.• Led a team of 3 engineers in the successful installation and setup of advanced laboratory equipment sourced from HQ, completing the project ahead of schedule and initiating research activities two weeks early.• Ensured the Singapore lab met HQ standards by overseeing equipment calibration, process qualification, and device qualification procedures.• Directed cross-functional teams (application/hardware engineers) across multiple global sites (US, Costa Rica, India) to deliver marketing-driven projects, managing tasks such as marketing requirement identification, test document review and approval, test execution, and overall project budget control.• Implemented Agile methodologies for daily and weekly task assignments, progress tracking, and status updates, monitoring both individual and overall team performance.• Troubleshot daily testing issues, including issue identification, replication, analysis, and root cause resolution, while collaborating with system and software teams for issue reassignment and closure.• Chaired weekly meetings with stakeholders to provide project updates, feedback on issues, and ensure alignment on progress and goals.

• Led system-level testing of equipment to ensure machine performance standards were met for each new model release.• Contributed to the development and testing of new process features, overseeing high-level reviews of feature acceptance criteria, test plans, and monitoring test case execution.• Guided a team of process engineers to optimize processes and implement new features, achieving improvements in bonding quality, unit per hour (UPH) output, and yield.• Coordinated teams of test engineers from multiple sites to develop automated testing solutions, replacing manual methods, increasing test coverage and efficiency, and reducing human intervention.• Managed the global customer issue reporting system, allocating resources across multiple sites to replicate issues, conduct root cause analysis, and ensure timely issue resolution.

In May 2007, successfully managed the transfer of new wafer-level packaging technology from EPCOS HQ in Germany to Singapore. EPCOS, one of the world's largest producers of passive electronic components, focuses on manufacturing SAW (Surface Acoustic Wave) filters in Singapore.• Led pre-assembly wafer-level packaging process development for new package types. Gained proficiency in photolithography processes, including photoresist lamination, mask alignment, and developing techniques.• Developed a strong understanding of frontend wafer fabrication, UBM (Under Bump Metallization) and wafer bumping processes.• Applied methodologies such as DOE, SPC, and FMEA for process development and optimization.• Managed new process transfers and qualifications using CRTP and AQTP procedures, monitoring product process stability, yield, and reliability.• Participated in the company's Six Sigma projects and coordinated annual B&E cost control and reduction programs.• Supervised a team of process and equipment engineers to resolve daily process and equipment issues, improving production yield and reducing scrap rates.• Conducted 8D and Corrective Action Reports (CAR) for subcontractors and suppliers to drive continuous process improvements, control incoming material quality, and prevent issue recurrence.• Collaborated with vendors on equipment modifications and qualified new equipment to meet production needs.