Wayne, Chih Wei Chen Email & Phone Number

Hsinchu County, Taiwan, Taiwan

● Collaborated with external foundry partners TSMC, UMC, SMIC process integration, product engineering and customer service team and internal product engineering, testing, planning and FA team on 12nm/16nm/28nm/ 40nm wireless communication and multimedia new product introduction (NPI) and mass production (MP) products and provided high level key projects status on major failure bins improvement action progress with yield and D0 forecast roadmap report to the top management. ● Managed NPI products with risk build authorization (RBA) ramp up tasks including tape out management, process window corner skew analysis, WAT devices analysis, test datalog analysis, yield correlation analysis, and coordinated internal and external cross team with all NPI issued resolved on time and lead the team to transfer to MP.● Managed to sustain MP yield and yield improvement actions with DOE, CIP, BKM, and defect reduction lot handling with wafer process, device and yield analysis and resulted yield improved 0.1%~3.0% on various products. ● Performed in-depth WAT devices, test datalog and yield analysis by utilizing Data Conductor and DataPower Exensio tools to investigate systematic low yield, single wafer low yield (SWLY), FACR/RMA root cause analysis and drive foundries to take immediate actions by identify excursion impact lot lists, inline process and tools correlation findings to minimize yield impact and improvement schedule.

Hsinchu County, Taiwan, Taiwan

● Managed DRAM, HBM, NAND, NOR, pSRAM memory product suppliers including Samsung, SK Hynix, Micron, KIOXIA, Micron, NTC, Winbond, ESMT, Giga Device, AP Memory, and supported TSMC 7nm/10nm products and CoWoS HBM process related tasks. Based on the principles of prevention, detection and disposition supplier management excellence and received Supply Chain Operation Team Award of the Year 2020 recognition.● Coordinated to RMA HBM IQC and slant cut issue dices successfully resulted saving 9.8 million USD potential loss, and received Star of HiSilicon Award, Hero Rescue Award ● Participated to setup internal KGD direct procurement system from indirect procurement system resulted saving X thousands USD per year procurement expenses and received Multi-Incentive Award recognition.● Published Known Good Die (KGD), High Bandwidth Memory (HBM), and Universal Flash Stored (UFS) supplier management guidelines including technology roadmap, products selection table, NPI corner skew guideline, MP yield criteria, inline and WAT SPC Cp/CpK review with R1/R2 rule, defect trend criteria, IQC/OQC benchmark criteria, FA analysis methodologies, reliability guidelines, and PCN classification criteria.● Hosted and managed suppliers QBR/QQR meetings with new products business plan, new product introduction discussion, quarterly yield, quality issue and scorecard review, and meeting minutes action items follow up.● Arranged suppliers monthly on-site meeting with NPI/MP yield update and yield forecast roadmap review, process inline/WAT trend chart with Cp/CpK R1/R2 rule review, top failure bins root cause finding with countermeasure update, defect trend chart review with CIP status, monthly reliability update, failure analysis status, and NPI/MP project status update.● Participated in supplier foundry audits for automotive and customer products with audit plan, result and ranking.

Hsinchu City, Taiwan, Taiwan

● Managed Touch and Display Driver Integration (TDDI) & Display Driver IC (DDIC) products from NPI ramp to MP, and ensure the device characteristics, test datalog specification, and yield performance met the internal target.● Key role as foundry contact interface managed to co-work with TSMC, UMC and PTC on 40nm/55nm/80nm/ 90nm DOE, BKM, CIP and defect reduction yield improvement lot management and summarize the analysis result to internal team for process implementation decision making to achieve internal yield target. Tracking and handling systemic failure, low yield excursion and FACR/RMA wafer lots investigation, disposition and corrective actions follow up. ● Setup Datapower Exensio EDA system with new production information for CP yield and WAT data upload, and utilized for yield map, device and testing data log correlation check for yield analysis and improvement.

Taichung City, Taiwan

● Developed component level FT EFA analysis with with Advantest T5593 tester and DIMM system level tester to identity electrical failure mechanism and failure location for test spec analysis and test coverage optimization and FA analysis with countermeasure actions.● Developed wafer level CP EFA analysis with voltage/timing/temperature/shmoo dependency analysis and failure bit map (FBM) capability with HAMAMATSU PHEMOS-1000 and Micron Test Bench to identity failure location and co-worked with PFA team on SEM/TEM/EDX/OBRICH FA finding results to process integration engineers for process window optimization resulted yield improvement.● Published T5593 tester and DIMM system level test, and HAMAMATSU PHEMOS-1000 and Micron test bench SOP guidelines as newcomers hands-on experience training materials. ● Managed to lead 15 team members and collaborated with Singapore and USA supporting team for AMAT E3 Fault Detection & Classification (FDC) system setup and completed the system conversion within 6 months. ● Developed AMAT E3 FDC system training course and quizzes, and as a course instructor trained and certified more than 300 process and equipment engineers.

Hsinchu City, Taiwan, Taiwan

● Responsible for 0.13um customers lot handling, experiment lot planning and WAT and yield result analysis, and handled MPW shuttle tape out, process flow and WAT setup, device corner skew analysis, SPC and PCN review.● 4 times SWLY root cause finding champions in 2005.● Successful to transfer 55nm advanced technology from R&D to Fab including critical process release standard check, MPW tape out tasks, device corner target tuning window check and analysis, process flow and WAT setup, and DOE/CIP lots handling and analysis.

Master Of Science - Ms, Electrical And Electronics Engineering

Bachelor Of Science - Bs, Electrical And Electronics Engineering