Wei-Su Chen Email & Phone Number

Hefei, Anhui, China

I worked for PSK as senior process manager to service Hefie customer CXMT from 2017/11/30 till 2019/7/19. I am looking for a new job now.

Hsinchu, Taiwan

1. 12" Refurbished Dual Beam FIB-SEM Survey, Purchasing and Buildup from 2014 till now2. 8"/12" ALD process development for ReRAM related high-k and metal materials.3. DNA Sequencing Sub-10 nm Fundamental Structure Development and Process Integration4. E-beam nanolithography for sub-10 nm pattern industrial service5. Thermal reflow process service for.

Hsinchu, Taiwan

1. Process Integration of ReRAM NVM Device 2. ITRI's 1st BEOL ReRAM Device integrated to foundry FEOL CMOS wafer on DUV lithography3. Innovative Patent Idea for ReRAM Device Structure and Extend Cross-Spacer PCM Patent Idea to ReRAM for Device Active Area Scaling Unlimited by Lithography4. Advanced E-beam Nanolithography Processes Development5. 8"/12" DUV.

Hsinchu, Taiwan

1. Develop phase change memory (PCM) with high endurance and data retention for ITRI’s PCM consortium with four Taiwan’s memory industry2. Process integration of PCM device and circuit on 8” CMOS wafer3. Develop e-beam and DUV hybrid lithography for cell size scaling of PCM device.4. 4Mb PCM chip integrated by hybrid e-beam/DUV lithography5. Cross-Spacer.

Hsinchu, Taiwan

1. I am responsible for ITRI’s DUV lithography process for MRAM device patterning2. I integrated ITRI’s 1st BEOL MRAM device with foundry FEOL CMOS wafer on lithography 3. Buildup ITRI’s e-beam nano-lithography environment 4. Apply the first organic bi-stable memory device (OBD) project in ITRI5. DUV Photoresist evaluation for Taiwan Everlight Chemical Co.

Hsinchu County/City, Taiwan

1. Develop OLED device with high brightness and long lifetime using new small molecule material and device structure/band diagram2. Develop OLED device with highest black/white contrast

Hsinchu, Taiwan

1.,Develop RF-MEMS Inductor device structure for high Q-factor2. Develop conductive resist process for MEMS device on tapered surface3. Develop SU8 ultra-thick resist process for deep RIE

Hsinchu, Taiwan

1. Maintain 8" PVDs, CVD, Low-k Coater, Furnace, Spin Etcher, Cu Plater, and CMP related process and metrology tools including ULVAC CS-1000 and AMAT Endura PVDs, Novellus Concept 2 HDP-CVD, TOK Low-k Coater, ASM A400 Furnace, SEZ Spin Etcher, CuTek Cu Plater, Strasbaugh CMP, OnTrak post-CMP cleaner, KLA-Tencor HRP and Nanospec ellipsometer and Rigaku XRF.

Doctor Of Philosophy (Phd), Semiconductor Manufacturing Technology

GaAs MESFET Device Characteristics with Si Channel Layer formed by Rapid Thermal Diffusion.

Master'S Degree, Semiconductor Manufacturing Technology

I studied two process technologies related to rapid thermal processing (RTP). First, through TaSix film implantation of Si into GaAs with.