Managed the company's global operations through its Shanghai office, covering internal manufacturing, external manufacturing, quality, SCM and procurement.

Managed the company's two business units, R&D, SCM, procurement, IE, quality, and facility.

Technology and Operations Management of the Flip Chip BU covering R&D, new product introduction, process engineering, equipment, manufacturing and quality. 100% moved the BU from Shanghai to Jiangyin since April of 2017.

Technology and Operations Management of Bumping and Flip Chip BU covering R&D, new product introduction, process engineering, equipment and manufacturing. Worked hard to make it better and relocate to Jiangyin city smoothly.

Managed the company's flip chip operations spanning NTI, NPI, engineering, equipment and manufacturing.

Managed a group of 50 people consisting of program and process managers/engineers, for Flip Chip bumping and assembly NTI and NPI, Flip Chip FOL and EOL process engineering, new package development and qualification with customers, new package ramp-up, and customer quality issue handling.

Bumping NPI, Flip Chip process engineering management, Flip Chip NTI and NPI, new package development with customers, new package ramp-up, customer quality issue handling.

Process engineering management, new package development focusing on fcBGA, Flip Chip assembly NPI and ramp-up into LVM, customer quality issue handling.

New package development focusing on fcBGA, Flip Chip assembly NPI, customer quality issue handling.

Mechanical and thermo-mechanical modeling, board-level reliability test, and new material characterization

Thermo-mechanical simulation focusing on packaging stress, warpage, and board-level temperature cycling reliability prediction. Board-level temperature cycling test, warpage test, mechanical bending and drop test.

Thermo-mechanical simulation focusing on packaging stress, warpage, and board-level temperature cycling reliability prediction.