Wenning Fu
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Wenning Fu Email & Phone Number

R and D RF Engineer Hardware at Broadcom
Location: San Jose, California, United States 5 work roles 3 schools
1 work email found @illinois.edu LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 86%

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Work email w****@illinois.edu
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Current company
Role
R and D RF Engineer Hardware
Location
San Jose, California, United States
Company size

Who is Wenning Fu? Overview

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Quick answer

Wenning Fu is listed as R and D RF Engineer Hardware at Broadcom, a with 57414 employees, based in San Jose, California, United States. AeroLeads shows a work email signal at illinois.edu and a matched LinkedIn profile for Wenning Fu.

Wenning Fu previously worked as R&D RF Engineer Hardware at Broadcom and Graduate Researcher at Nick Holonyak, Jr. Micro And Nanotechnology Laboratory. Wenning Fu holds Doctor Of Philosophy - Phd, Electrical Engineering, Gpa 3.92/4.00 from University Of Illinois Urbana-Champaign.

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{first_initial}{last}@illinois.edu
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Profile bio

About Wenning Fu

Wenning Fu is a R and D RF Engineer Hardware at Broadcom.

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Wenning Fu's current company

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Broadcom
Broadcom
R and D RF Engineer Hardware
San Jose, CA, US
Website
Employees
57414
AeroLeads page
5 roles

Wenning Fu work experience

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R And D Rf Engineer Hardware

San Jose, Ca, Us

R&D Rf Engineer Hardware

San Jose, California, United States

Graduate Researcher

Graduate research advisor: Prof. Milton FengHigh-speed VCSEL research for optical communications in room-temperature and cryogenic applications* High-speed VCSEL design, modeling, fabrication and testing. * Performed full VCSEL fabrication process flow. (Multi-level mask layout and photolithography, PECVD deposition, ICP-RIE dry etch, E-beam evaporation, etc)* Implement designs for a fundamental-mode-dominant emission.* Set up fiber & free-space optical coupling. Familiar with beam profile test.* Experienced with LIV, spectrum, bit-error-rate & eye-diagram test, parameter network analyzer (PNA), arbitrary waveform generator, electrical & optical spectrum analyzer and on-wafer probing.* High-speed electrical packaging (PCB, wire-bonding, etc) and optical packaging for reliable prototype deliverables. * Designed module integration (MCM) with a miniature multi-layer biasing network between stimulus chip and VCSEL. Interfaced with MIT Lincoln Lab for fabrication.* Familiar with different dispersion types in optical fiber.* Set up 100 Gb/s RF testing capability. ** Record over 50 GHz direct-modulation bandwidth with cryogenic VCSEL at low temperature. 50 Gb/s data transfer at 5K and 77K demonstrated for preliminary results.** Demonstration of 20 Gb/s optical data link from superconducting-processor-modulated VCSEL at 4 K to room-temperature end user. Interfaced with and supported by NIWC Pacific, NIST and Hypres, Inc.** Room-temperature-optimized VCSEL: 50 Gb/s NRZ error-free transmission over 100-meter OM4 fiber at room temperature, and up to 115 °C operation.Development and research in beam-steering antenna based on high-speed semiconductor devices.* Design and simulation in ANSYS HFSS and Keysight ADS.* High-speed device development including epitaxial design, fabrication, layout, and implementation.* Interfaced with epitaxial wafer vendor to grow the designed layer structure. Interface with GaAs foundry.

Aug 2017 - Dec 2022

Teaching Assistant

• ECE 447 Active Microwave Circuit Design: Lab TA • ECE 495 Photonic Device Laboratory : Lab TA (beam profile characterization, etc)• ECE 340 Semiconductor Devices: Homework and Grading Management• ECE 329 Field and Waves: Tutorial Session TA, Piazza forum and Course Website Management

Aug 2017 - Dec 2022

Undergraduate Research Assistant

Development of antenna-coupled MIM diode infrared detector.* Responses were measured at 36 different polarization angles. Then the responsivity due to field-assisted tunneling was accurately extracted.

Jan 2016 - Dec 2016
Team & coworkers

Colleagues at Broadcom

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3 education records

Wenning Fu education

FAQ

Frequently asked questions about Wenning Fu

Quick answers generated from the profile data available on this page.

What company does Wenning Fu work for?

Wenning Fu works for Broadcom.

What is Wenning Fu's role at Broadcom?

Wenning Fu is listed as R and D RF Engineer Hardware at Broadcom.

What is Wenning Fu's email address?

AeroLeads has found 1 work email signal at @illinois.edu for Wenning Fu at Broadcom.

Where is Wenning Fu based?

Wenning Fu is based in San Jose, California, United States while working with Broadcom.

What companies has Wenning Fu worked for?

Wenning Fu has worked for Broadcom, Nick Holonyak, Jr. Micro And Nanotechnology Laboratory, and University Of Illinois Urbana-Champaign.

Who are Wenning Fu's colleagues at Broadcom?

Wenning Fu's colleagues at Broadcom include Khoi Nguyen, Zeeshan Ali, Thai Tran, Manuel Preclaro, and 郭威志.

How can I contact Wenning Fu?

You can use AeroLeads to view verified contact signals for Wenning Fu at Broadcom, including work email, phone, and LinkedIn data when available.

What schools did Wenning Fu attend?

Wenning Fu holds Doctor Of Philosophy - Phd, Electrical Engineering, Gpa 3.92/4.00 from University Of Illinois Urbana-Champaign.

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