Dallin Whipple Email & Phone Number

Chandler Az

Chandler, Az

Parts, Materials and Processes group. Developed and wrote test plans, conducted experiments and analyzed results on non-metallic materials to improve processes and products, mitigate obsolescence, or determine the cause of failure.· Determined the thermal loads used during qualification testing were the cause of the test failure and showed that flight thermal loads would not cause a similar adhesive failure.· Reduced process time and cost by adding microbeads to an alternative adhesive for bond line control prior to qualification testing. This eliminated a material with a history of procurement problems and reduced the number of steps required to build parts.· Investigated the capabilities of NDI shearography equipment by comparing images of known defects to unknown defects in composite and adhesively bonded samples.

Tempe, Az

Designed and conducted experiments on direct wafer bonding of Si to GaAs. Used EVG 520 bonder/embosser, plasma etcher, IR transmittance, and X-ray diffraction. Analyzed samples, compiled results, drew conclusions, and acted on conclusions. · Located source of contamination which was the plasma etching system. · Determined cause of electrical problem during plasma etcher installation.

Ms, Materials Science And Engineering

Thesis topic: Direct Wafer Bonding of GaAs and Si

School; Bachelor Of Science, Materials