Expert in trouble shooting and supporting production facilities in different kind of assembly issues all over the world. Strong knowledge in applied material science and excellent experience in material behavior in processes. Especially in thermoset materials, like epoxy, polyurethanes, silicones, and adhesives like materials. Very good in translating ideas into practical solutions and a strong focus on delivering results on time.Responsible for the release of the green epoxy molding compounds for NXP Hong Kong (previously Philips semiconductor) in close cooperation with Henkel Huawei Electronics (HHE) in China and Cookson Semiconductor Materials in Singapore.Project leader of several projects within Philips Research in the area of encapsulation technology, like semi-conductors and LEDs, medical systems and systems for ASML (producer of wafer-steppers). My expertise is used in hundreds of project throughout Philips but also at external companies, covering research, product development, process development, industrialization, reliability and problem solving.Expertise:Trouble shooting, Green Belt. (Six Sigma, V-model, FMEA, Verification en Validation)Working as a project leader.Material expert in Silicones, Epoxies, Poly Urethanes and adhesives.Applying materials, transfer-molding, dispensing and jetting. Adhesive specialist.Cure behaviors.