William Buggy Email & Phone Number

Hutto, TX, US

Round Rock, Texas, US

Santa Clara, CA, US

US

LED Luminaire Designer

HK

• Responsible for managing and supporting the OEM project teams from Hong Kong, China, and Germany. The parent company was the largest mail-order company in Germany with products in categories such as hand tools, power.
• Completed projects from conception to production, including QC, product manuals, certificates, and QA support
• Spearhead the rollout of short-term and long-range strategies that will achieve client mutual objectives
• Worked directly with factories to help develop new products through in-person presentations and frequent site visits
• Trained and led Product Conception team by working directly with QS Engineers ensuring proper design, safety, and delivery

• Responsibilities as a Mechanical Engineer was to work on the test socket and thermal designs and solution for the semiconductor industry (AMD’s Flip Chip, High Power GPU, and APU devices). Assigned as acting director.
• Managed multiple projects from start to finish with the design and test parameters set and maintained
• Designed a thermal solution for high power, high pin count Flip-Chip devise for AMD
• Assisted with defining the process and WI to ensure the product was fabricated and assembled correctly
• Managed China-based Engineers and helped establish a test socket production and repair, supply line and vendor chain
• Facilitated 5S training and improved OEE performances to attain goals by client deadlines

• Directly accountable for all aspects of designing and tooling of the semiconductor industry for customer-specific package drawings. Designed machine parts and test sockets using DFM and DFA principals.
• Troubleshoot and re-designed machine parts for several different final test tools
• Maintained BOM assembly drawings using CAD and PDM software with design specifications and criteria guidelines
• Created final test sockets and designed hand tested solutions for different package sizes from 0.3mm to 2x2 DFN
• Increased the manufacturing cycle times by 7% through streamlining the manufacturing KIT fabrication process

Austin, Texas, US

• Supported the Motorola/Freescale NPI and Test/Assembly, as well as global sites in Malaysia and China. Completed over 50 projects yearly and supported new test platforms and handler tooling. Pioneered the Probe Card.
• Supported engineering builds and tooling for the NPI assembly group, including sphere, and die-attach
• Increased package delivery by supervising and performing tooling modifications and decreasing time to market
• Ensured all personnel was trained and all tools maintained for optimal yield and OEE performances
• Installed the first Multi-test 9318 high-speed gravity feed handler that increased throughput by 15% reducing cycle time
• Contributed and Designed test hardware sockets and hand test options for various packages in the global NPI group

General Studies

Certification, Mechanical Engineering Related Technologies/Technicians