William Hong

William Hong Email and Phone Number

Packaging TE Engineer at Apple @ Apple
cupertino, california, united states
William Hong's Location
Minhang District, Shanghai, China, China
William Hong's Contact Details

William Hong work email

William Hong personal email

n/a
About William Hong

% 7+ years Experienced Packaging Engineer with a demonstrated history of working in the semiconductors industry. Skilled in Electronics Packaging, Corrugated, Folding Cartons, Manufacturing, and Packaging Design.% Experienced in Abaqus/Ansys dynamic simulation for packaging materials/system. Familiar with shock and vibration on mechanical structural related testing.% Experienced in provide packaging innovation solution for semiconductor manufacturing supply chain, solving packaging related problems in logistics including warehouse and transportation. % Project/Supplier management and packaging testing/problem trouble shooting are also my core capabilities.% Now a member of ISTA (International Safety Transportation Association) China Board.

William Hong's Current Company Details
Apple

Apple

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Packaging TE Engineer at Apple
cupertino, california, united states
Website:
apple.com
Employees:
218112
William Hong Work Experience Details
  • Apple
    Packaging Pd Engineer
    Apple Jul 2023 - Present
    Shanghai, China
    View
  • Ista China
    Board Member
    Ista China Sep 2019 - Aug 2023
    Shanghai City, China
  • Intel Corporation
    Senior Packaging Engineer
    Intel Corporation May 2013 - Aug 2023
    Shanghai City, China
    Senior Packaging Engineer, experienced in:Wafer, Chipset, Semi-conductor products packaging solution;PCB, SSD, Server products packaging solution;Primary, secondary and tertiary packaging solution;Packaging in warehouse storage and transportation;Packaging, manufacturing and supply chain integration.
    View

William Hong Skills

Packaging Engineering Packaging Corrugated Food Packaging Artioscad Plastics Retail Packaging Folding Cartons Lean Manufacturing Product Development Electronics Packaging

William Hong Education Details

  • Jiangnan University
    Jiangnan University
    Packaging Science
  • Qingdao University Of Science And Technology
    Qingdao University Of Science And Technology
    Packaging Science

Frequently Asked Questions about William Hong

What company does William Hong work for?

William Hong works for Apple

What is William Hong's role at the current company?

William Hong's current role is Packaging TE Engineer at Apple.

What is William Hong's email address?

William Hong's email address is wi****@****tel.com

What schools did William Hong attend?

William Hong attended Jiangnan University, Qingdao University Of Science And Technology.

What are some of William Hong's interests?

William Hong has interest in Swimming, New Technologies, Football, Table Tennis.

What skills is William Hong known for?

William Hong has skills like Packaging Engineering, Packaging, Corrugated, Food Packaging, Artioscad, Plastics, Retail Packaging, Folding Cartons, Lean Manufacturing, Product Development, Electronics Packaging.

Who are William Hong's colleagues?

William Hong's colleagues are Dasari. Durga Prasad, Carolyn Boccignone, Rahul Sharma, Francisco Morales, Lunga Bloko, Nicholas Ehrmann, ايشاا ايشاا.

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