William Hunks Email & Phone Number
@entegris.com
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Who is William Hunks? Overview
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William Hunks is listed as Associate TS and D Scientist at Dow, a with 45847 employees, based in United States. AeroLeads shows a work email signal at entegris.com and a matched LinkedIn profile for William Hunks.
William Hunks previously worked as Associate TS&D Scientist at Dow and Applied Technology Scientist at Evonik. William Hunks holds Ph.D., Organometallic Chemistry from Western University.
Email format at Dow
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AeroLeads found 1 current-domain work email signal for William Hunks. Compare company email patterns before reaching out.
About William Hunks
Synthetic chemist with >10 years of experience in research and development of innovative technologies in adhesives, materials science, nanotechnology, pharmaceuticals, and microelectronic devices. Skilled in chemical synthesis and analysis, thin film deposition, polymerization, formulations, and ceramics.
Listed skills include Materials Science, Chemistry, Nanotechnology, Thin Films, and 18 others.
William Hunks's current company
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William Hunks work experience
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Associate Ts And D Scientist
Associate Ts&D Scientist
Applied Technology Scientist
Senior Chemist
R&D areas:• Synthesized novel air-sensitive organometallic precursors for semiconductor processes and evaluated their deposition properties for metal, metal oxide, nitride, and chalcogenide films by chemical vapor deposition (CVD) or atomic layer deposition (ALD)• Developed CVD/ALD precursors and processes for the production of low-k dielectric films, high-k metal oxides for DRAM capacitors, phase-change memory (PCM/PRAM) devices, barrier layers in integrated circuits, and metal electrodes and contacts• Examined the thermal stability, volatility, and transport properties of synthesized CVD precursors and formulations; evaluated film composition, conformality, surface morphology, and electrical properties of deposited thin films• Collaborated with semiconductor IDMs and OEMs on new technologies for advanced memory applications and dielectrics for logic devicesKey achievements:• Developed novel metal-organic chemical vapor deposition (MOCVD) precursors and scaled-up synthetic processes• Designed chemistry for the deposition of porous low-k organosilica films (k < 2.2) for dielectric layers in BEOL semiconductor processes; formulated a solution for CVD of void-free silica composites in narrow features (<45nm) for shallow trench isolation (STI)• Discovered GST chemistry that provided a low-temperature conformal CVD process which yielded PRAM memory devices with < 50ns switching speeds and 1E9 cycle endurance• Knowledge of KBM methodologies (lean six-sigma, SPC, MSA, DOE, and TRIZ), member of emergency response team (ERT), certified HazMat emergency responder and incident commander, trained in CPR and First AidPatents and publications: 21 issued US patents, 4 journal publications, and 6 conference proceedings.
Research Chemist
R&D areas: • Conducted multi-step organic synthesis of pharmaceutical molecules• Purified organic molecules: chromatography, lyophilization, crystallization, and distillationKey achievements:• Synthesized 5 NCE target molecules for drug screening by pharmaceutical companies and government agencies
Postdoctoral Researcher
Advisor: Geoffrey OzinResearch areas: • Investigated the sol-gel polymerization and self-assembly of poly(alkoxysilanes) containing bridge-bonded organic groups using structure-directing species (surfactant micelles, PEO-PPO-PEO block copolymers) to form novel periodic mesoporous organosilicas (PMOs)• Modified the properties of PMOs by synthesizing novel organosilane precursors to form PMO frameworks comprised of MT and DT organosilica units, combined flexible aliphatic and rigid phenylene linkages, and added sulfide bridges • Prepared transparent PMO coatings using the evaporation induced self-assembly (EISA) procedure• Examined the structure, thermal stability, and adsorption properties of nanoporous organosilanesPatents and publications: 6 journal publications, 2 invited reviews.Awards and scholarships:NSERC Postdoctoral fellowship
Colleagues at Dow
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Tom Method
Colleague at DowMacomb, Missouri, United States
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Michele Frankson
Colleague at DowKaty, Texas, United States
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Erika Brooks
Colleague at DowBoston, Massachusetts, United States
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Marcel Neven
Colleague at DowTerneuzen, Zeeland, Netherlands
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Sarah Huss, Cpa
Colleague at DowMidland, Michigan, United States
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Adriano Torres
Colleague at DowSalvador, Bahia, Brazil
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Philippe Walter
Colleague at DowGreater Strasbourg Metropolitan Area, France
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Kalpana Singh
Colleague at DowAhmedabad, Gujarat, India
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Joshua Sullivan
Colleague at DowSaginaw, Michigan, United States
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吴禹霖
Colleague at DowChangping District, Beijing, China
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William Hunks education
Ph.D., Organometallic Chemistry
B.Sc., Chemistry
Frequently asked questions about William Hunks
Quick answers generated from the profile data available on this page.
What company does William Hunks work for?
William Hunks works for Dow.
What is William Hunks's role at Dow?
William Hunks is listed as Associate TS and D Scientist at Dow.
What is William Hunks's email address?
AeroLeads has found 1 work email signal at @entegris.com for William Hunks at Dow.
Where is William Hunks based?
William Hunks is based in United States while working with Dow.
What companies has William Hunks worked for?
William Hunks has worked for Dow, Evonik, Entegris, Starks Associates Inc., and University Of Toronto.
Who are William Hunks's colleagues at Dow?
William Hunks's colleagues at Dow include Tom Method, Michele Frankson, Erika Brooks, Marcel Neven, and Sarah Huss, Cpa.
How can I contact William Hunks?
You can use AeroLeads to view verified contact signals for William Hunks at Dow, including work email, phone, and LinkedIn data when available.
What schools did William Hunks attend?
William Hunks holds Ph.D., Organometallic Chemistry from Western University.
What skills is William Hunks known for?
William Hunks is listed with skills including Materials Science, Chemistry, Nanotechnology, Thin Films, Design Of Experiments, Coatings, Inorganic Chemistry, and Atomic Layer Deposition.
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