Developed mechanics design for optical modems and laser transmitter used forspaceflight communications. Worked with a multidisciplinary team to ensure allcustomer specifications were achieved, including size, weight thermal performanceand vibration.Results: Successful Deployment snd operations Laser Transmitter on NASA’sDeep Space Optical Communications (DSOC) platform on the Psyche spacecraft,which is currently the longest optical communication slink the history ormankind. Successful deployment an operation of the Illuma-T optical modemon the international space station.✦ Managed seven person mechanical engineer team for the phase 1 development of asatellite-based optical modem and telescope, and ground-based telescope station.✦ Developed mechanical design for aircraft-based optical low noise amplifier(OLNA) and 50 W laser system, both intended for airborne LIDAR.✦ Perform Micrometeoroid Impact and Radiation Dose Analyses to ensure design willmeet mission objectives.✦ Produced build-to drawings and data packages, and collaborated with and managed3rd party vendors to resolve specification, performance, and reliability issues andrealize the commercial and custom-machined parts necessary to build thesubsystem.✦ Supported the effort to transition designs into limited volume production, includingdevelopment of assembly processes and writing of build procedures.✦ Collaborated with teams across all phases of product development, includingconcept generation, requirements development, and subsystem design,qualification, manufacture, and deployment while meeting technical, cost, andschedule objectives.✦ Collaborated with hardware designers to jointly optimize PCB layout.✦ Prepared and delivered project presentations to customers, including technicalanalysis, design review, and progress reports.

✦ Lead Engineer and Project Manager of a seven-person cross-functional team for thedevelopment of optical-fiber-based laser combiner and high-brightness, low-NA,tapered-fiber bundles.• Led development from project conception through prototype production.• Created cost model to evaluate project and product profitability.• Working extensively and directly with customers to ensure customer requirementsare met.• Designed and implemented new class of packaging for high-power laser products,including identification and testing of new packaging materials.▪ Technical Interface with other divisions on transfer of new packagingtechniques.▪ Documented new techniques via manufacturing procedures and engineeringnotes.• Successfully led early-stage gate reviews, and presented project status tomanagement.• Developed new production process, documented processes via written workinstructions, and trained production personnel.✦ Initiated and led the development of fully-computerized testing methods and software,helping to ensure the accuracy of data reported to customers and facilitate statisticalprocess control (SPC)✦ Coded original, user-friendly software, that writes test data to SQL database.✦ Developed new shipping packaging for existing products, which dramatically reducedcosts and serves as a production fixture for final test.✦ Redesigned production fixtures, which improved throughput and resulted in $10k peryear cost saving.✦ Pioneered use of 3D-printed parts within the division.✦ Developed mechanical designs using SolidWorks for new products, including OpticalFiber Lasers, Very Large Mode Area Amplifiers (VLMA), and Cascading RamanResonators (CRR).

Lead Engineer and Project Manager for development of miniature camera moduleproducts, several of which went to high-volume production.• Supervised and coordinated efforts of multidisciplinary, multinational project teamto ensure design goals and product deadlines were met.▪ Developed mechanical designs using SolidWorks for miniature zoom and autofocus lens systems utilizing machined and low-cost injection-molded plastics.• Managed transfer of designs to Asian assembly subcontractors.▪ Developed and implemented design-documentation system for effectivecommunication with Asian assembly subcontractors.• Utilized 3D solid modeling and finite-element analysis (FEA) to analyze thermal andmechanical stresses in miniature camera module products.

Lead Engineer and Project Manager of a five-person, cross-functional project team forthe development of a silicon optical bench platform for high-speed telecommunicationreceiver products.• Utilized computerized 3D-design and modeling techniques, to perform mechanicaldesign, assembly-tolerance analysis, and thermal & mechanical stress analysis.• Pioneered the use hybrid, thin-film technologies within the division.• Reported project status to senior management via formal design-review process.✦ Hands-on development of high-volume, high-yield manufacturing processes for fiberoptic connectors.• Successfully implemented lean manufacturing principals in a redesigned productioncell.• Used Design of Experiment (DOE) to determine optimum process parameters,Statistical Process Control (SPC) to monitor production cell yield’ and Lean-Manufacturing Principals in formulating the production cell’s design.